Method of forming passage in substrate for MEMS module

Inactive Publication Date: 2009-01-22
LINGSEN PRECISION INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]The present invention has been accomplished in view of the above-noted circumstances. It is one objective of the present invention to provide a substrate passage formation method for forming a passage through a substrate for a MEMS (Micro-Electro-Mechanical System) module, which has the characteristic of lowering the height of the substrate for use in a low profile MEMS module.
[0012]The invention employs etching and injection molding techniques to form a passage in a substrate. Therefore, the invention allows the use of one single piece substrate to substitute for a conventional stack substrate structure. The spirit of the invention is to form a predetermined path step by step by means of etching, and to form multiple support layers step by step by means of injection molding. When compared with the prior art design, the invention can lower the height of the substrate.

Problems solved by technology

However, it is difficult to form a nonlinear sensor passage in a substrate directly.
Further, a stack substrate structure that is made by means of stacking multiple plate members together may encounter a peeling problem between two plate members.

Method used

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  • Method of forming passage in substrate for MEMS module
  • Method of forming passage in substrate for MEMS module
  • Method of forming passage in substrate for MEMS module

Examples

Experimental program
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first embodiment

[0038]As shown in FIGS. 1-7, a method of forming a passage in a substrate for MEMS module in accordance with the present invention includes the flowing steps

[0039]a) Provide a substrate 10 having a thickness less than 0.30 mm or preferably 0.25 mm, as shown in FIG. 1. The substrate can be made from glass fiber-contained resin, epoxy, polyimide resin, FR4 resin, or BT (bismaleimide-triazine) resin. And then, etch the bottom side of the substrate 10 to form a first space 12 in the substrate 10, as shown in FIG. 2.

[0040]b) Fill up the first space 12 of the substrate 10 with a thermal setting resin by means of injection molding to form a first support layer 20 in the substrate 10, as shown in FIG. 3, having an anti-etching coefficient greater than the substrate 10.

[0041]c) Etch the top side of the substrate 10 to form a second space 14 so as to define a sacrifice portion 16 surrounded by the second spaces 14 and having a predetermined profile of the desired passage, as shown in FIG. 4.

[...

second embodiment

[0046]FIGS. 9-15 show the steps of a method of forming a passage in a substrate for MEMS module in accordance with the present invention as follows.

[0047]a) Provide a substrate 40 having a thickness less than 0.30 mm or preferably 0.25 mm, as shown in FIG. 9. The substrate 40 can be made from glass fiber-contained resin, epoxy, polyimide resin, FR4 resin, or BT (bismaleimide-triazine) resin. Etch the bottom side of the substrate 40 to form a first space 42 in the substrate 40, as shown in FIG. 10.

[0048]b) Etch the top side of the substrate 40 to form a second space 44 and to define a sacrifice portion 46 surrounding the second space 44 and having a predetermined profile of the desired passage, as shown in FIG. 11.

[0049]c) Fill up the first space 42 of the substrate 40 with a thermal setting resin by means of injection molding to form a first support layer 50 in the substrate 40, as shown in FIG. 12, having an anti-etching coefficient greater than the substrate 40.

[0050]d) Fill up th...

third embodiment

[0054]FIGS. 16-23 show the steps of a method of forming a passage in a substrate for MEMS module in accordance with the present invention as follows.

[0055]a) Provide a substrate 60 having a thickness less than 0.30 mm or preferably 0.25 mm, as shown in FIG. 16. The substrate 60 can be made from glass fiber-contained resin, epoxy, polyimide resin, FR4 resin, or BT (bismaleimide-triazine) resin. And then, etch the substrate 60 to form a first space 62 having a first portion at the bottom side of the substrate 60 and a second portion vertically penetrating the substrate 60 and communicating with the first portion, as shown in FIG. 17.

[0056]b) Etch the substrate 60 to form a second space 64 having a first portion at the top side of the substrate 60 and a second portion vertically penetrating the substrate 60 and communicating with the first portion so as to define a sacrifice portion 66 of a predetermined pattern between the first and second spaces 62 and 64, as shown FIG. 18.

[0057]c) F...

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Abstract

A method of forming a passage in a substrate for a MEMS module is disclosed to include the steps of respectively forming a first support layer and a second support layer in a first space and a second space, which are respectively formed in a bottom side and a top side of a substrate by etching, by injection molding to define a sacrifice portion between the first and second support layers, and removing the sacrifice portion from the substrate by etching to form a passage defined between the first support layer and the second support layer in the substrate with two ends in communication with ambient atmosphere.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates generally to Micro-Electro-Mechanical System (hereinafter referred to as “MEMS”) modules and more specifically, to a method of forming a passage in a substrate for use in a MEMS module.[0003]2. Description of the Related Art[0004]In order to improve the performance of a MEMS module, the mechanical support strength and other environmental factors, such as interference of noises, must be taken into account during packaging of the MEMS module. Some MEMS devices have a particular structure. For example, a microphone receives an external signal from the bottom side. In this case, the substrate must provide a curved sensor passage in communication with the bottom side of the MEMS chip so that the MEMS chip can receive an external signal from the bottom side.[0005]However, it is difficult to form a nonlinear sensor passage in a substrate directly. According to conventional methods, the formation o...

Claims

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Application Information

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IPC IPC(8): C23F1/00
CPCB81C1/00309B81B2201/0257H01L2224/48091H01L2924/16151H01L2924/00014
InventorTIEN, CHIUNG-YUEHYANG, HSI-CHEN
OwnerLINGSEN PRECISION INDS