Method of forming overlay mark structure
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first embodiment
[0009]Please refer to FIGS. 1-8. FIGS. 1-8 are schematic drawings illustrating a method of forming an overlay mark structure according to the present invention, wherein FIG. 1, FIG. 3, FIG. 5 and FIG. 7 are top-view diagrams, and FIG. 2, FIG. 4, FIG. 6, and FIG. 8 are cross-sectional diagrams. FIG. 3 is a schematic drawing in a step subsequent to FIG. 1, FIG. 5 is a schematic drawing in a step subsequent to FIG. 3, and FIG. 7 is a schematic drawing in a step subsequent to FIG. 5. FIG. 2 is a cross-sectional diagram taken along a line A-A′ in FIG. 1, FIG. 4 is a cross-sectional diagram taken along a line B-B′ in FIG. 3, FIG. 6 is a cross-sectional diagram taken along a line C-C′ in FIG. 5, and FIG. 8 is a cross-sectional diagram taken along a line D-D′ in FIG. 7. The method of forming the overlay mark structure in this embodiment may include the following steps. As shown in FIG. 1 and FIG. 2, an insulation layer 30 is formed on a substrate 10, and a first overlay mark OM1 is formed i...
second embodiment
[0018]Please refer to FIGS. 10-13, FIG. 2, FIG. 6, FIG. 8, and FIG. 9. FIGS. 10-13 are schematic drawings illustrating a method of forming an overlay mark structure according to the present invention. FIG. 11 is a schematic drawing in a step subsequent to FIG. 10, FIG. 12 is a schematic drawing in a step subsequent to FIG. 11, and FIG. 13 is a schematic drawing in a step subsequent to FIG. 12. In addition, FIG. 10 may be regarded as a schematic drawing of the manufacturing condition the main region corresponding to the manufacturing condition of FIG. 2, FIG. 11 may be regarded as a schematic drawing of the manufacturing condition the main region corresponding to the manufacturing condition of FIG. 6, FIG. 12 may be regarded as a schematic drawing of the manufacturing condition the main region corresponding to the manufacturing condition of FIG. 8, and FIG. 13 may be regarded as a schematic drawing of the manufacturing condition the main region corresponding to the manufacturing cond...
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