Growing device of gas inner circulation type hot wire chemical vapor deposition (CVD) diamond films
A diamond film and growth device technology, applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of small growth area, low growth rate, low film quality, etc., to reduce consumption, hydrogen The effect of consumption reduction
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2012-10-10
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a diamond film growth device, in particular to a gas internal circulation hot wire CVD diamond film growth device. Background technique
[0002] Due to its good optical, mechanical, electrical and chemical stability properties, diamond coating has a wide range of applications in industry and daily life. The initial diamond synthesis was mainly the high temperature and high pressure method. Although it has many disadvantages such as harsh preparation conditions, low synthesis quality, and high cost, it is still the preferred method for preparing diamond. In the past two decades, the study of low-temperature and low-pressure chemical vapor deposition of diamond films has attracted much attention from researchers all over the world. At present, the commonly used preparation methods mainly include microwave CVD, hot wire CVD, DC arc plasma, combustion method, etc., and their commonality is that the plasma generated by the low mol...
Examples
Embodiment Construction
[0014] A gas internal circulation type hot wire CVD diamond film growth device, the device includes a closed vacuum chamber with a reaction chamber inside. A fan 4 is arranged on the top of the inner wall of the reaction chamber, and a hot wire array 1 composed of multiple parallel straight tungsten wires is arranged under the fan 4; 2 is provided with a thermocouple 3; the outer wall of the vacuum chamber above the side of the fan 4 is provided with an air inlet 5;
[0015] Wherein: the air intake flow rate of the air inlet 5 and the suction flow rate of the air extraction port 6 are both 0~200 sccm.
[0016] During work, the pre-cleaned silicon wafer substrate is placed on the substrate tray 2, and then the pressure in the reaction chamber is pumped to 10 with a mechanical pump and a molecular pump. -3 ~10 -4 Pa. Heat the wire array 1 to 1800~2000°C by increasing the voltage of direct current, and inject 200 sccm of CH from the air inlet 5 4 +H 2 (The volume ratio is 1:...