5results about How to "Speed ​​up the release" patented technology

Disclosed is a gripping device using an air conduit. This device can quickly complete the "release" of the gripping state of an article. After compressed air for gripping flows into a first pipe, the compressed air is accumulated in a side wall expansion space of a cylindrical air conduit, and the compressed air is moved through a second pipe and the air conduit, which are opened by a reverse valve, to be instantaneously discharged to the outside. Therefore, the "release" of the article can be quickly completed. Finally, in a transfer operation in which the gripping, transfer, release, and reset processes of the article are repeatedly performed, the operation time can be greatly shortened.

The utility model relates to aluminium die casting technical field provides a kind of aluminium die casting mould of quick cooling, main component: the main component includes lower mould, upper mould and injection port;The upper mould is installed in the upper of lower mould, and injection port is opened in the top of upper mould;Cooling component: the cooling component includes connecting groove, mounting bracket and water storage bucket;The connecting groove is opened in the outer wall both sides of upper mould, and mounting bracket is slidably connected in the outer wall both sides of upper mould.The utility model can be connected block through the trajectory sliding of connecting groove by the auxiliary cooperation between water storage bucket and water sprayer, the water spraying range of water sprayer can be adjusted, the mould can be cooled quickly, it is convenient for staff to take out the aluminium die casting after forming, improve the efficiency of aluminium die casting production, by cooling medium atomization injection to mould surface, using droplet evaporation heat absorption principle, can significantly speed up mould heat dissipation speed, realize quick and even cooling effect.

The utility model relates to the technical field of semiconductor processing, and disclose an IGBT module packaging structure and IGBT module, IGBT module packaging structure includes shell body and base plate, the lower end of shell body is pasted connection through the colloid with the upper end of base plate, and the front and back of shell body all are equipped with a plurality of internal thread holes who are opened in the whole, and the inner wall thread sleeve of every internal thread hole is provided with the external thread sleeve, the inner wall fixed sleeve of external thread sleeve is provided with waterproof and breathable membrane, and the outer end fixed mounting of external thread sleeve is located the baffle of shell body outside. The utility model through shell body, base plate, internal thread hole and waterproof and breathable membrane's cooperation and cooperation, with the help of waterproof and breathable membrane realizes the air countercurrent of shell body inside and outside, effectively speeds up the heat dissipation of module inside, improves the problem that traditional closed shell heat dissipation is limited, promotes overall heat dissipation efficiency, waterproof and breathable membrane can block the invasion of external dust, water vapor into the shell body inside at the same time, avoids dust accumulation, damp leakage, guarantees the stable work of internal chip, base plate and other elements.

This utility model provides an LED backlight structure, relating to the field of LED backlight technology. It includes a frame, with a backplate fixedly mounted on one side of the inner wall of the frame, and a light source plate slidably mounted on the other side of the inner wall. A mounting plate is also provided on one side of the frame. The frame includes three closed sides and one open side, with connecting buckles fixedly mounted at both the upper and lower ends of the open side. This structure utilizes a copper and aluminum composite backplate design to achieve efficient heat conduction and uniform heat dissipation, effectively extending the lifespan of the LED light source. The hollow heat sink structure increases the heat dissipation area and heat flow circulation, preventing light leakage. The overall structure is compact, eliminating the need for fans and air ducts, meeting the requirements of thin, quiet devices. The quick-installation mechanism of the mounting plate and connecting buckles ensures rapid disassembly and assembly of the light source plate, improving maintenance efficiency and reducing operating costs. It is suitable for applications requiring frequent light source replacement. The structure is lightweight, has efficient heat dissipation, is easy to assemble, and possesses good environmental adaptability.

The utility model relates to the technical field of power supplies, and discloses a high-power combined power supply structure, which comprises a shell, a heat conducting plate, a power supply main body, a shell cover, a cold water heat absorbing pipe I and a cold water heat absorbing pipe II, the heat conducting plate is arranged in the shell, the power supply main body is arranged on the heat conducting plate, and the shell cover is fixedly arranged at the upper end of the shell through a screw assembly. A plurality of T-shaped heat conduction seats are fixedly installed on the shell cover at intervals through connecting blocks, limiting grooves matched with the bottoms of the T-shaped heat conduction seats are formed in the surface of the heat conduction plate, the cold water heat absorption pipe I is arranged on the front side portion of the shell cover in a penetrating mode, and the cold water heat absorption pipe II is arranged on the rear side portion of the shell cover in a penetrating mode. According to the utility model, the radiating speed of heat generated during the operation of the power supply main body is improved, the radiating effect is effectively ensured, and the situation that the power supply main body is easy to be overheated is prevented.