This invention belongs to the field of
spintronics technology, and specifically discloses a Hessler
alloy with adjustable
damping factor and its preparation method. The preparation method includes preparing a Hessler
alloy thin film on a substrate; applying a
voltage to a piezoelectric
ceramic to put the piezoelectric
ceramic in a stretched state; attaching the substrate with the Hessler
alloy thin film to the stretched piezoelectric
ceramic, with the easy
magnetization axis direction [110] of the Hessler
alloy thin film parallel to the stacking direction of the piezoelectric ceramic; removing the
voltage to obtain a Hessler alloy with adjustable
damping factor in a compressed state. This invention achieves low-power, reversible control of the
damping factor of the Hessler alloy through piezoelectric strain, and is applicable to fields such as magnetic
random access memory, spin logic devices, and flexible magnetic sensors.