Method and apparatus for cutting substrate into multiple units by once irradiating of laser beam

A technology of substrate and light, applied in glass cutting devices, optics, nonlinear optics, etc., can solve problems such as unpredictable cracks and impossible to predict the direction of crack extension

Inactive Publication Date: 2008-10-01
SAMSUNG DISPLAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Thus, there is a problem that it is almost impossible to predict the direction of extension of the generated cracks, and as a result, parts that do not need to be cut are cut
[0009] Due to the use of diamond cutting machines, there is a problem that unpredictable cracks are generated, and the cracks are extended during the division of the complete LCD master into cell panels

Method used

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  • Method and apparatus for cutting substrate into multiple units by once irradiating of laser beam
  • Method and apparatus for cutting substrate into multiple units by once irradiating of laser beam
  • Method and apparatus for cutting substrate into multiple units by once irradiating of laser beam

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Embodiment Construction

[0024] Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0025] 1 to 3 show the structure of a beam multiple splitting device according to a preferred embodiment of the present invention;

[0026] As a whole, the beam multiple splitting device 500 includes at least one light reflectance / transmittance control board 510, 520, 530, 540, a light incident angle control unit 555 and a light reflectance / transmittance control board 510, 520, 530 , 540 and the base body (not shown) of the light incident angle control unit 555.

[0027] Four light reflectance / transmittance control plates 510, 520, 530, 540 are used in this embodiment.

[0028] Specifically, the light reflectance / transmittance control boards 510, 520, 530, 540 are manufactured to have the following functions, that is, when light with a certain wavelength and intensity reaches the corresponding light reflectance / transmittance control boards 510,...

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Abstract

A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity / transmittance control plates are placed on a path through which the light passes such that light reflectivity / transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

Description

technical field [0001] The present invention relates to a technique for cutting a substrate into a plurality of units, and more particularly, to a method and an apparatus for cutting a substrate into a plurality of units using light. Background technique [0002] In general, glass substrates are widely used in industrial fields, commercial fields, residential fields, and the like. These glass substrates are made of silicon as a main component. [0003] These glass substrates have an amorphous structure, which is an inherent property of glass. When minute grooves are formed at the edge of the glass substrate, the amorphous structure as a factor causes minute cracks to appear by a slight impact or a small external force. When an external impact or force is applied to a micro crack, the crack propagates in an unpredictable direction, resulting in undesired separation in the glass substrate. [0004] Thus, there is a problem that it is almost impossible to predict the directi...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): B23K26/00B26F3/16B23K26/067C03B33/023C03B33/033C03B33/09C03B33/10G02F1/1333
CPCG02F1/133351C03B33/102B23K26/067C03B33/093B23K26/0673B23K26/1417B23K26/146Y02P40/57C03B33/09
Inventor南亨佑秋大镐全栢均
OwnerSAMSUNG DISPLAY CO LTD