Method and apparatus for cutting substrate into multiple units by once irradiating of laser beam
A technology of substrate and light, applied in glass cutting devices, optics, nonlinear optics, etc., can solve problems such as unpredictable cracks and impossible to predict the direction of crack extension
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[0024] Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0025] 1 to 3 show the structure of a beam multiple splitting device according to a preferred embodiment of the present invention;
[0026] As a whole, the beam multiple splitting device 500 includes at least one light reflectance / transmittance control board 510, 520, 530, 540, a light incident angle control unit 555 and a light reflectance / transmittance control board 510, 520, 530 , 540 and the base body (not shown) of the light incident angle control unit 555.
[0027] Four light reflectance / transmittance control plates 510, 520, 530, 540 are used in this embodiment.
[0028] Specifically, the light reflectance / transmittance control boards 510, 520, 530, 540 are manufactured to have the following functions, that is, when light with a certain wavelength and intensity reaches the corresponding light reflectance / transmittance control boards 510,...
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