Method for effectively controlling useful time of grinding pad

Abstract

The invention discloses a method capable of effectively controling the service life of grind pad, comprising following steps: a. users find out the original service life of each grind pad; b. before the grind pad is repaired, users record the shearing speed of the grind pan during the repair; c. when the service life of each grind pad is about to end, users repeatedly measure the depth of the remained groove of the grind pad until the depth of the remained groove of the grind pad reaches the limit, then the time is the true service lift of the grind pad; d. users repeat the step b and c to get the correlative relationship between the grind speed and the true service life of different grind pans; e. when the grind pad is repaired in practice, the true service life of the grind pad is availably estimated according to the grind speed of the grind pan. The invention has an advantage that the true service life of the grind pad is approximately or exactly reached without extra cost because of the estimation of the shearing speed of each grind pan.

Description

technical field [0001] The invention relates to a chemical mechanical polishing method in semiconductors, in particular to a method for effectively controlling the service life of a polishing pad. Background technique [0002] In recent years, with the increase in integration and density of semiconductor devices, more and more devices have thin-film structures, so that a technology that can accurately planarize the thin-film surface on the surface of the thin-film structure is required. [0003] One of the wafer planarization techniques is chemical mechanical polish. In this technique, a wafer held by a carrier is pressed against a polishing pad attached to a rotating platform. The polishing pad is used to polish the surface of the wafer while being supplied with a chemical polishing solvent. [0004] The grinding pad and the grinding disc are two very important consumables in the CMP process, among which: the main functions of the grinding pad include: 1) Carrying the slur...

AI Technical Summary

Problems solved by technology

Obviously, if the grinding discs with the maximum value and the minimum value are used to repair the grinding pad respectively, and the service life of the grinding pad corresponding to the central value is managed, the grinding disc with a high shear rate may lose too much due to the groove The remaining grooves are too shallow, resulting in scraps during the CMP grinding process; the grinding disc with a low shear rate has less groove loss and the remaining grooves are deeper, resulting in unnecessary waste due to replacement before the real life is reached

In order to avoid debris, some factories manage according to the life of the grinding pad corresponding to the grinding disc with the maximum shear rate, resulting in more waste

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