Method for effectively controlling useful time of grinding pad

Abstract

The invention discloses a method capable of effectively controling the service life of grind pad, comprising the following steps that: firstly, the original service life of each grind pad is confirmed; secondly, before the grind pad is repaired, the service time of the grind pan during the repair is recorded; thirdly, when the service life of each grind pad is about to end, the depth of the remained groove of the grind pad is repeatedly measured until the depth of the remained groove of the grind pad reaches the limit, then the time is the true service lift of the grind pad; ,fourthly, the second and the third steps are repeated to get the correlative relationship between the service time and the true service life of different grind pans; fifthly, when the grind pad is repaired in practice, the true service life of the grind pad is availably estimated according to the service time of the grind pan. The invention has an advantage that the true service life of the grind pad is approximately or exactly reached without extra cost because of the estimation of the service life of grind pad for each service time of grind pan.

Description

technical field [0001] The invention relates to a chemical mechanical polishing method in semiconductors, in particular to a method for effectively controlling the service life of a polishing pad. Background technique [0002] In recent years, with the increase in integration and density of semiconductor devices, more and more devices have thin-film structures, so that a technology that can accurately planarize the thin-film surface on the surface of the thin-film structure is required. [0003] One of the wafer planarization techniques is chemical mechanical polish. In this technique, a wafer held by a carrier is pressed against a polishing pad attached to a rotating platform. The polishing pad is used to polish the surface of the wafer while being supplied with a chemical polishing solvent. [0004] The grinding pad and the grinding disc are two very important consumables in the CMP process, among which: the main functions of the grinding pad include: 1) Carrying the slur...

AI Technical Summary

Problems solved by technology

If pads are managed with a fixed pad life, there is likely to be an increased risk of chip scrap due to too much groove loss at the beginning of the pad's life and too little groove left; There are many remaining grooves, which leads to unnecessary waste of replacement before the actual service life of the polishing pad

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