Heat radiation module and its heat pipe

Abstract

The heat elimination module includes heat pipe and at least one heat elimination fin. Being setup outside heat pipe, heat elimination fins are connected to main body of heat pipe. Heat pipe includes main body of heat pipe, upper cover, first and second capillary structures and working fluid. Main body of heat pipe possesses a base, and a sidewall setup around the base. An enclosed space is formed when the upper cover is combined with main body of heat pipe. Upper cover is penetrated by a hollow tube with one end being extended inside heat pipe. First capillary structure is setup on inner surface of base of main body of heat pipe, and second capillary structure is connected to body of hollow tube. Being contacted to first capillary structure, second capillary structure makes working fluid condensed on upper cover possible along hollow tube to enter to second capillary structure and flow to first capillary structure.

Description

technical field [0001] The invention relates to a heat dissipation module, in particular to a heat dissipation module with high-efficiency heat pipes. Background technique [0002] With the advancement of technology, the number of transistors per unit area of ​​electronic components is increasing, resulting in an increase in heat generation during operation. On the other hand, the operating frequency of electronic components is also getting higher and higher, and the heat (switch loss) caused by the on / off (on / off) conversion during transistor operation is also the reason for the increase in the heat generation of electronic components. If the heat is not handled properly, the computing speed of the chip will be reduced, and in severe cases, the life of the chip may even be affected. In order to enhance the heat dissipation effect of electronic components, most of the current practices are to use a heat sink to dissipate the heat at the heat source, and dissipate the heat t...

AI Technical Summary

Problems solved by technology

However, the effect of only using the bell-shaped upper cover 14b as a guide is limited, and this bell-shaped upper cover 14b makes the water injection pipe 18 installed outside it more protruding outwards, resulting in the overall heat pipe 10B The occupied volume increases, and if the columnar heat pipe 10B is to be used together with the heat dissipation fins and the fan, under the limited space constraints, the outwardly protruding upper cover 14b and the water injection pipe 18 must not be compatible with the heat dissipation fins. chip and fan are well assembled

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