Heat-sensitive digital level transducer

A sensor and thermal technology, applied in the field of thermal digital level sensor, can solve the problems of corrosion of the induction electrode and the influence of conductivity, and achieve the effect of enhancing the anti-interference ability, solving the installation, and improving the stability and reliability.

Inactive Publication Date: 2009-12-02
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] The purpose of the present invention is to provide a heat-sensitive digital level sensor with simple structure, strong adaptability and low cost, so as to solve the problem that the existing level sensor is affected by the conductivity of the material to be measured, causing the induction electrode to produce electric corrosion

Method used

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Embodiment Construction

[0026] The specific embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings, so that those skilled in the art can make the thermal digital level sensor of the present invention according to the specific embodiments, and can also use the thermal digital level sensor of the present invention. The sensitive digital level sensor measures the level and displays it digitally.

[0027] The structure of the elongated insulator 2 described in the specific embodiment of the present invention can be a rectangular parallelepiped shape, a cylindrical shape, or other types that can be provided with a heat-sensitive element 1 and a heat-sensitive circuit 3, and are made of epoxy resin. The long insulator 2 is connected to the long body of the microprocessor 7 and the power supply.

[0028] In the embodiment of the present invention, at least two heat-sensitive elements 1 arranged longitudinally on the elongated insulator 2 desc...

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Abstract

A heat-sensitive digital level sensor is provided with at least two heat-sensitive elements longitudinally arranged on an elongated insulator, and two wires are respectively connected to a heat-sensitive circuit, a microprocessor and a power supply. The measurement method is to fix it in the material bin. The thermal sensor on the sensor is connected to the corresponding thermal sensor circuit. The temperature of the thermal sensor buried by the material changes relative to the temperature not buried by the material. The state of the thermal sensor circuit Turn from "0" to "1", the temperature of the unburied thermal element does not change relative to the ambient temperature, the output state of the corresponding thermal sensing circuit is still "0", and the thermal sensing circuit is counted by the microprocessor scanning circuit The number of "1" in the circuit state is the accurate digital level value. The invention can realize direct digitized and accurate measurement of crushed materials such as solids, liquids, stones, sand, coal, etc., and has a wide range of applications.

Description

Technical field [0001] The invention relates to a material level sensor, in particular, a thermal-sensitive digital material level sensor that uses a thermally sensitive element to measure the material level. Background technique [0002] Existing material level detection technology and products include "ultrasonic sensors". Such as CN2148949's "Adaptive Ultrasonic Level Meter" invention patent, this product is an ultrasonic transmitter and receiver device. When measuring the material level, install the instrument far away from the material surface, transmit and receive ultrasonic waves to the material surface, measure the reflected wavelength and period of the ultrasonic waves, and measure the distance between the material surface and the instrument to determine the material level. This product is mainly used for material level detection in wide areas and has a narrow scope of application. [0003] "Pressure sensor". With the development of semiconductor technology, semiconducto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01F23/22
Inventor 周义仁吕青
Owner TAIYUAN UNIV OF TECH
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