Flexiable printing wiring board

A flexible printing and wiring board technology, applied in printed circuits, electrical components, etc., can solve problems such as narrowing the gap between components and circuit substrates, and poor flux cleaning, and achieve the effect of improving shielding properties and suppressing noise.

Inactive Publication Date: 2010-06-02
NIPPON MEKTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with the case where there is no ground pattern on the lower surface of the component, the gap between the component and the circuit board is narrowed, and the cleaning performance of the flux is deteriorated.

Method used

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  • Flexiable printing wiring board
  • Flexiable printing wiring board
  • Flexiable printing wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Fig. 1 shows an example of the pattern of the flexible printed wiring board (FPC) of the present invention, the basic structure of this FPC 1 and Figure 7 The structures shown in ˜ FIG. 8 are the same, so repeated descriptions of the same structural parts are omitted.

[0033] and Figure 7 8 is the same as FPC1 in FIG. 8 , since the shielding property is kept good, the copper foil 4 is left as a ground pattern at the lower part of the component 6 . In this invention, the notch part 11 is provided in this ground pattern, and the thickness part of the copper foil 4 is partially removed. At least one notch 11 is provided at a lower position of member 6 .

[0034] In the illustrated example, a notch portion 11 is recessed in a substantially central portion of the member 6 along the spraying direction of the cleaning liquid. Further, a notched protruding portion 11 a is provided so that at least one end of the notch portion 11 on the side where the cleaning liquid is sp...

Embodiment 2

[0042] FIG. 4 shows another example of the pattern of the FPC of the present invention, and repeated description of the same structural parts as in the first embodiment is omitted.

[0043] In this embodiment, at the left and right substantially central parts of the member 6, a notch 11 is recessed along the spraying direction of the cleaning liquid, and the upper and lower ends of the notch 11 protrude from the outer periphery of the member 6 to the upper and lower outer sides. There are two notched protrusions 11a, 11a. Further, notch portions 11B, 11B are provided branchingly from the upper and lower substantially central portions of the notch portion 11 toward the left and right sides.

[0044] In this way, among the notches 11 in the vertical direction, the notches 11B diverge in a plurality of different directions (left and right directions in the illustration) at the lower position of the member 6, so the groove-like recesses 12B formed by the depression of the coating ...

Embodiment 3

[0050] Figure 7 It shows another example of the pattern of the FPC of this invention, and the repeated description of the same structural part as Example 1 and Example 2 is omitted.

[0051] In this embodiment, a notch 11 is recessed in the substantially central part of the component 6 along the spraying direction of the cleaning liquid, so that the upper and lower ends of the notch 11 protrude from the outer periphery of the component 6 to the upper and lower outer sides, and two notches are provided. Protrusions 11c, 11c. The protruding portion 11c located outside the member 6 is formed to be wider than the width of the notch portion 11 at the lower portion of the member 6 . That is, the width of the notch portion 11 becomes narrower from the protruding portion 11 c protruding outward of the member 6 to the lower portion of the member 6 .

[0052] Therefore, the groove-shaped concave portion 12 formed by the depression of the coating 5 also has a narrower width at the low...

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PUM

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Abstract

The invention provides a flexible printed circuit board with a good shield characteristic, which improves the cleaning performance taking the pure water as fluxing agent. A slot portion in the grounding pattern is arranged at the lower portion of the part. A groove-shaped concave portion is formed at the lower position of the part by partly removing the copper foil. If spraying the cleaning liquid, the cleaning liquid immerges into the lower portion of the part following the groove-shaped concave portion from the outer side of the part. And the cleaning liquid immerges in the gap between the part and the cover film so as to remove the fluxing agent.

Description

technical field [0001] The present invention relates to a flexible printed wiring board, in particular, to a flexible printed wiring board in which a ground pattern is formed on a copper foil at a lower part of a component to maintain shielding properties and improve the cleanability of flux after soldering. Background technique [0002] In general, in the manufacturing process of printed circuit boards, when components are mounted, a flux is used to remove oxides on the surface of copper foil (conductor) in order to improve the solderability of solder. However, if the flux flows into the gap between the lower surface of the component and the surface of the circuit board, and residues of the flux remain, the influence of the humidity of the atmosphere during use and movement due to the applied voltage will occur, and the insulation resistance of the circuit board will decrease. The function of electronic equipment is damaged. Then, after mounting the components, the flux mu...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H05K1/00
Inventor井上和夫
OwnerNIPPON MEKTRON LTD