A method of performing model-based scanner tuning

A scanner and imaging model technology, which can be used in instruments, photolithography process of pattern surface, microlithography exposure equipment, etc., can solve the problems of time-consuming, expensive, and achieve low-cost
CN101373338AActive Publication Date: 2009-02-25ASML NETHERLANDS BV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ASML NETHERLANDS BV
Publication Date
2009-02-25

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Abstract

A model-based tuning method for tuning a first lithography system utilizing a reference lithography system, each of which has tunable parameters for controlling imaging performance. The method includes the steps of defining a test pattern and an imaging model; imaging the test pattern utilizing the reference lithography system and measuring the imaging results; imaging the test pattern utilizing the first lithography system and measuring the imaging results; calibrating the imaging model utilizing the imaging results corresponding to the reference lithography system, where the calibrated imaging model has a first set of parameter values; tuning the calibrated imaging model utilizing the imaging results corresponding to the first lithography system, where the tuned calibrated model has a second set of parameter values; and adjusting the parameters of the first lithography system based on a difference between the first set of parameter values and the second set of parameter values.
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Description

technical field

[0001] The present invention generally relates to a method and a program product for implementing model-based scanner tuning and optimization, which method and program product enable performance optimization of a multi-lithography system. Background technique

[0002] A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, the mask may contain a circuit pattern corresponding to a single layer of the IC, and this pattern may be imaged onto a target portion (e.g., including a portion of the die, one or more tubes) on the substrate (silicon wafer). core), the substrate has a layer of radiation-sensitive material (resist). Typically, a single wafer will contain an entire network of adjacent target portions that are successively exposed one at a time via the projection system. In one type of lithographic projection apparatus, each target portion is irradiated by exposing the entire pattern onto the target...

Claims

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