Preparation method of electroplating diamond fret saw

Abstract

The invention relates to a preparation method of an electroplating diamond fret saw, comprising the following technological processes: 1. roughening processing is carried out to micrometer diamond particles in advance, nanometer diamond powder is added in cationic surface active agents according to the proportion of 1 : 3 by mass ratio, so as to prepare uniform and stable nanometer diamond powdersuspending liquid, plating solution is arranged in an electroplating tank, after the weighted nanometer diamond powder suspending liquid is mixed with the micrometer diamond particles according to the proportion of 1 : 3 by mass ratio, and then the mixture is added in the plating solution, the plating solution is circulated continuously, and nickel aminosulfonate is main material in the plating liquid, and boracic acid and nickel chloride are additionally added, and a magnetic stirring device is arranged in the electroplating tank; 2. a steel wire continuously and uniformly passes through theelectroplating tank, under the action of electrical current, nickel ions move to cathode from anode, so as to drive the nanometer diamond powder and the micrometer diamond particles to move to the steel wire, so as to lead the steel wire to be plated with the nanometer diamond powder and the micrometer diamond particles, meanwhile, chemical nickel-plating is carried out to the steel wire; 3. after the steel wire is separated from the electroplating tank, wires are wound up after being cleaned and dried. The method can continuously and quickly produce electroplating diamond fret saw, and the production efficiency is high.

Description

(1) Technical field [0001] The invention relates to a preparation method of an electroplated diamond wire saw. The electroplating diamond wire saw is mainly used to cut crystal rods (Ingot) such as monocrystalline silicon into wafers (Wafer). (2) Background technology [0002] In the past five years, the electronics, new energy, and optical industries have developed rapidly, and the number of manufacturers who cut monocrystalline silicon and other crystal rods (Ingot) into wafers (Wafer) has continued to increase. The mainstream cutting process on the market is "bare steel wire + abrasive slurry". Compared with the previous internal circular saw, this cutting method using free abrasives has the advantages of being able to cut large-diameter ingots and cutting multiple sets of wires at the same time, but it also has the following obvious disadvantages: [0003] 1) The ingot and its processing area are polluted by fat-based abrasive liquid; [0004] 2) The slurry-like grind...