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Flexible display panel and manufacturing method thereof

A technology for display panels and manufacturing methods, applied in the fields of nonlinear optics, optics, instruments, etc., which can solve the problems that the flexible substrate 120 is not easy to remove, has poor corrosion resistance to chemical solvents, and cannot bear it

Active Publication Date: 2012-10-10
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, the use of the organic adhesive material 110 still has the following bottlenecks in the manufacturing process that still need to be overcome: first, the general thin film transistor array (such as amorphous silicon thin film transistor) has a maximum The process temperature is as high as about 370°C, while the current highest heat-resistant temperature of the existing organic adhesive material 110 is about 200°C-250°C, so the organic adhesive material 110 cannot withstand cracking and cracking during the manufacturing process of the existing thin film transistor array. The phenomenon of out-gassing leads to warping of the flexible substrate 120; second, the organic adhesive material 110 has poor resistance to chemical solvents and cannot withstand the manufacturing process of the existing thin film transistor array. The chemical solvent used causes the flexible substrate 120 to warp
[0007] In order to improve the problem of poor heat resistance and chemical resistance of the organic adhesive material 110, in the prior art, an appropriate amount of inorganic powder is usually mixed into the organic adhesive material 110 to improve its heat resistance and chemical resistance. The inorganic powder Although the doping of the organic adhesive material 110 will improve the adhesive force, it will cause the flexible substrate 120 to be difficult to remove from the hard substrate 100, so that the process of removing the flexible substrate 120 from the hard substrate 100 , the thin film transistor array 130 on the flexible substrate 120 (such as Figure 1E shown) is destroyed
[0008] In addition to doping the organic adhesive material 110 with inorganic powder, there is also a prior art that uses a light-sensitive adhesive material. After the thin film transistor array is fabricated, the adhesive material is hardened and loses its adhesiveness by lighting. The flexible substrate 120 can be easily removed, but the disadvantage of this technology is that the material selection of the light-sensitive adhesive material is not much, and the material cannot be selected arbitrarily.

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  • Flexible display panel and manufacturing method thereof

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no. 1 example

[0063] figure 2 It is a flow chart of the manufacturing method of the flexible display panel according to the first embodiment of the present invention. Please refer to figure 2 , The manufacturing method of the flexible display panel of this embodiment includes: providing a rigid substrate (step S200); providing a flexible substrate, the flexible substrate has a first surface and a second surface (step S210) ; Forming a plurality of release areas on the first surface, wherein the bonding strength of the area outside the release area is greater than the bonding strength of the release area (step S220); forming an adhesive layer on the hard substrate and the flexible substrate Between the first surface (step S230); form a plurality of display units on the second surface, and each display unit is located above one of the out-of-form regions (step S240); pattern the flexible substrate to obtain a plurality of respectively The flexible carrier carrying the display unit (step S...

no. 2 example

[0076] Figure 6A to Figure 6E It is a schematic cross-sectional view of the manufacturing method of the flexible display panel according to the second embodiment of the present invention. Please refer to Figure 6A and Figure 6E , the manufacturing method of this embodiment is similar to that of the first embodiment, but the main difference between the two lies in: the manufacturing method of the release region R of this embodiment is different. In detail, the method for forming the release region R in this embodiment includes forming a plurality of hydrophobic coatings or nano-coatings 240 on a plurality of partial regions of the first surface 220a.

[0077] Please refer to Figure 6E , the flexible display panel 300' of this embodiment includes a flexible carrier 220', a display unit 230, and a coating 240, wherein the flexible carrier 220' has two surfaces, and the display unit 230 is disposed on the flexible On one surface of the flexible carrier 220 ′, the coating 2...

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Abstract

The invention relates to a flexible display panel and a manufacturing method thereof, and the manufacturing method comprises the following steps: providing a rigid substrate; providing a flexible substrate, wherein the flexible substrate comprises a first surface and a second surface; forming a plurality of release regions on the first surface, wherein the bonding strength outside the release regions is greater than that of the release regions; forming an adhesion layer between the rigid substrate and the first surface of the flexible substrate; forming a plurality of display units on the second surface, wherein each display unit is respectively positioned above one release region; pattering the flexible substrate for obtaining a plurality of flexible carrier plates carrying the display units; and separating the flexible carrier plates from the adhesion layer.

Description

【Technical field】 [0001] The present invention relates to a display panel and its manufacturing method, and in particular to a flexible display panel and its manufacturing method. 【Background technique】 [0002] In terms of display development, with the progress of optoelectronic technology and semiconductor manufacturing technology, flat display panels (flat display panels) with superior characteristics such as high image quality, good space utilization efficiency, low power consumption, and no radiation have gradually become the mainstream of the market. [0003] In today's display technology, due to the advantages of light weight, impact resistance, flexibility, wearability and portability, flexible display panels have become a new generation of forward-looking display technology. However, in the current flexible display panel manufacturing process, the main technical bottleneck lies in how to fabricate a Thin-Film-Transistor Array (TFT Array) on a flexible substrate. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/167G02B26/02
Inventor 陈正忠胡克龙胡至仁
Owner AU OPTRONICS CORP