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Substrate processing device and covering element thereof

A technology for processing substrates and covering components, which is applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as preventing protrusions from being smoothly formed on the surface of substrates.

Inactive Publication Date: 2011-05-11
WONIK IPS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This may hinder the smooth formation of protrusions on the surface of the substrate

Method used

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  • Substrate processing device and covering element thereof
  • Substrate processing device and covering element thereof
  • Substrate processing device and covering element thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The present invention will now be described in detail with reference to the accompanying drawings.

[0039] The substrate processing device according to the invention and the cover element used therefor will be explained in more detail below.

[0040] figure 1 is a cross-sectional view of a substrate processing apparatus according to the present invention, figure 2 yes figure 1 Perspective view of a cover element of a substrate processing apparatus, Figure 3A and 3B is shown figure 1 A cross-sectional view of a preferred embodiment of a cover element of a substrate processing apparatus, Figure 4A and 4D is shown figure 1 Bottom view of a preferred embodiment of a cover element of a substrate processing apparatus.

[0041] Such as figure 1 As shown, and the substrate processing apparatus of the present invention includes a processing chamber 100 forming a processing space S; a substrate having a lower electrode and configured to directly mount or assemble one...

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PUM

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Abstract

The invention discloses a substrate processing device for processing substrate etching and a covering element thereof. The substrate processing device comprises a processing cavity forming a processing space, a substrate supporting plate and the covering element; the substrate supporting plate is provided with a lower electrode and is configured to form a structure that one or more substrates areassembled on the substrate supporting plate directly or through a tray; the covering element is provided with a plurality of openings passing through an upper direction and a lower direction and is configured to cover the substrates at intervals; a covering space is formed between the bottom surface of the covering element and each of the substrates, and one or more parts of the side of the covering element are opened so that gas introduced into the covering element from the opening and byproducts generated during substrate processing flow to the side surface of the substrate supporting plate.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more particularly, to a vacuum processing apparatus capable of performing substrate processing such as etching processing, and a cover member used therefor. Background technique [0002] A substrate processing apparatus includes a processing chamber forming a processing space, and a substrate support plate installed in the processing chamber and configured to mount a substrate thereon. The substrate processing apparatus is used to etch the surface of a substrate or perform a deposition process on the substrate by applying electric energy to the processing space together with injecting gas thereinto. [0003] The substrates processed by the substrate processing apparatus may include wafers for semiconductors, glass substrates for LCD panels, substrates for solar cells, and the like. [0004] As an example of a substrate processing apparatus, there is a substrate for solar cells moun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/67
Inventor 金炳埈
Owner WONIK IPS CO LTD