Method for processing base plate conveyance

Abstract

The invention discloses a method for processing base plate conveyance, comprising: providing a plurality of base plates in a base plate containing cassette, taking two base plates of the base plates out from the base plate containing cassette by using a first upper manipulator and a first lower manipulator, and conveying to a double-layered sheet feeder, the double-layered sheet feeder conveying the two base plates to a base plate cleaning machine bench, the cleaning machine bench conveying the two base plates to a double-layered sheet discharger; the first upper manipulator and the first lower manipulator taking the cleaned two base plates out of the double-layered sheet discharger, and conveying to a first double-layered sheet feeder / discharger, rotating a rotatable temporary storage machine bench by a first angle, a second upper manipulator and a second lower manipulator taking the cleaned two base plates from the first double-layered feeder / discharger, and conveying to a base plate processing machine bench for processing and the second upper manipulator and the second lower manipulator taking the processed two base plates from the base plate processing machine bench, and conveying the processed two base plates to a second double-layered feeder / discharger. The method improves the conveying and processing efficiency of the base plate.

Description

technical field [0001] The present invention relates to a transportation system and method, and in particular to a substrate transportation system and method. Background technique [0002] With the increasing demands and applications of integrated circuits, how to reduce the manufacturing cost has become the primary problem faced by every semiconductor factory and / or panel factory. [0003] In the semiconductor and / or panel process, a large number of processes are performed on a substrate for manufacturing integrated circuits and / or thin film transistors on the substrate. These processes involve sequentially depositing and etching several conductive and insulating layers on the substrate. Since reaction residues are usually left on the substrate surface after each processing step, in order to prevent these process residues from affecting the subsequent process and prevent the reaction chamber and other substrates from being polluted by process residues, most of them are cur...

AI Technical Summary

Problems solved by technology

In terms of the current machine operation, the substrate processing efficiency is often limited by the speed of the robot arm and the efficiency of picking and placing substrates, which cannot be effectively improved.

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