Radiating device and LED (light emitting diode) lamp applying same
A heat dissipation device and LED lamp technology, applied in cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., can solve the heat transfer effect of heat dissipation fins that are difficult to weld on aluminum substrates, and soft silicone heat-conducting insulating pads General and other problems, to achieve the effect of good heat dissipation, simple structure, and tight welding
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0026] In order to make the object, technical solution and advantages of the invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0027] see Figure 1 to Figure 3 , a heat dissipation device, comprising an aluminum substrate 2 and an aluminum heat sink 3 fixed on the aluminum substrate 2; the aluminum heat sink 3 includes a plurality of heat dissipation fins 31, and the surface of the heat dissipation fins 31 is provided with a nickel-plated layer A tin layer is provided between the heat dissipation fins 31 and the aluminum substrate 2, and the heat dissipation fins 31 and the aluminum substrate 2 are welded together through the tin layer.
[0028] Wherein, the thickness of the nickel plating layer is 10 microns-20 microns, and the optimum thickness is 15 microns. The thickness of the nickel plating layer is moderate, which can not only satisfy the better welding effect, but also sa...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 