The invention discloses a light-emitting
diode. The light-emitting
diode comprises a
glass cover plate, a
ceramic substrate, a light-emitting
diode chip and a circuit structure layer. The
ceramic substrate is provided with a groove. The shape of the
glass cover plate is matched with the shape of the groove, and the
glass cover plate covers the groove. The contact surface of the
ceramic substrate and the glass cover plate is provided with a
glaze layer. The contact surface of the glass cover plate and the groove is provided with a glass paste layer. The glass paste layer is used for
welding theglass cover plate and the
ceramic substrate together in a fusion way. The light-emitting diode
chip is arranged in the groove, and the light-emitting diode
chip is connected with the circuit structure layer. According to the light-emitting diode, the smooth
glaze layer is manufactured on the surface of the
ceramic substrate, and low temperature compact
fusion welding of the glass cover plate andthe
ceramic substrate is realized by using the glass paste so that the
process complexity can be reduced, and the packaging
air tightness and the reliability of the light-emitting diode can be enhanced.