One-hole welding mold and welding process for electronic components
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 许行彪
- Publication Date
- 2011-11-30
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a welding mold for electronic components and a welding process using the mold, in particular to a welding forming process using a single mold, in particular to a one-hole welding mold for electronic components and a welding process. Background technique
[0002] Now, the traditional welding process of electronic components (diode, etc.) is the process of welding the upper and lower welding dies. The traditional welding consists of a lead wire on the upper welding die and a lower welding die on each of the upper and lower soldering dies. The aperture is generally about 0.1-0.15mm larger than the diameter of the lead wire. In addition, the upper and lower dies need to be positioned and matched. There is a fit gap during welding, which is prone to welding misalignment and the weld is not tight; at the same time, due to the oxidation of the welding die at high temperature, the aperture As the size increases, it will cause more seri...