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Oxygen-free copper composite welding method

A composite welding and oxygen-free copper technology, which is applied in welding equipment, welding equipment, auxiliary welding equipment, etc., can solve the problems of large deformation, solder overflow, etc., and achieve good vacuum sealing, high welding precision and tight combination.

Active Publication Date: 2014-05-28
INST OF ELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above technical problems, the present invention provides an oxygen-free copper composite welding method to solve the problems of solder overflow and large deformation in the existing oxygen-free copper material welding technology

Method used

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  • Oxygen-free copper composite welding method

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0026] The oxygen-free copper precision welding method in this example is as follows: the contact surface roughness of the welded parts is 0.4, the parts are immersed in acetone solution and ultrasonically cleaned for 30 minutes, and then put into a hydrogen furnace for hydrogen annealing treatment. The hydrogen burning temperature is 550 ° C. The holding time is 60min. Then assemble the oxygen-free copper parts to ensure that the joint surfaces are in close contact, and use methods such as centering rods to fix the relative positions. Into a vacuum furnace, and apply a 0.2MP diffusion pressure by means of heavy objects, the vacuum degree is always better than 1×10 during the diffusion welding process -3 Pa, heat up to 950°C at a heating rate of 15°C / min, hold for 60 minutes, then cool to 300°C at a rate of 10°C / min, and then cool to room temperature with the furnace, that is, low-pressure diffusion welding is completed; Put the electric vacuum solder in the solder hole, the ...

example 2

[0028] The difference between this example and Example 1 is that the roughness of the contact surface of the workpiece to be welded is 0.2, and the others are the same as Example 1.

example 3

[0030] The difference between this example and Example 1 is that the low-pressure diffusion welding pressure is 0.08MPa, and the others are the same as Example 1.

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Abstract

The invention provides an oxygen-free copper composite welding method by combining low pressure diffusion welding with brazing compound welding. The oxygen-free copper composite welding method comprises the steps: step A, preprocessing multiple oxygen-free copper parts to be welded to remove the oxide film on the surfaces of the oxygen-free copper parts; step B, assembling the multiple oxygen-free copper parts, fixing the relative position of each oxygen-free copper part to ensure close contact of welding faces, and carrying out low pressure diffusion welding on the welding faces of the oxygen-free copper parts; step C, placing electric vacuum brazing filler metal in the welding holes preset in the edges of the welding faces and brazing the multiple oxygen-free copper parts. A composite welding head formed through the oxygen-free copper composite welding method is bonded tightly, the precision of welding is high, the vacuum leakproofness is good, and the joint tensile strength is 200-300 MPa, being close to or even higher than the oxygen-free copper base metal strength.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to an oxygen-free copper composite welding method. Background technique [0002] Oxygen-free copper has the advantages of high electrical conductivity and thermal conductivity, low oxygen content, easy machining, and non-magnetic properties. It is the most widely used structural material in vacuum electronic devices. In many structures, the connection of oxygen-free copper is involved. At present, welding methods such as brazing, argon arc welding, and diffusion welding are often used. [0003] With the miniaturization of devices, the volume of high-frequency bands is reduced by dozens of times, and the internal structure of vacuum electronic devices is more precise, and all contact surfaces are required to achieve metallurgical bonding. The commonly used brazing method is difficult to control due to the overflow of solder, and it is difficult to connect all the contact surfaces w...

Claims

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Application Information

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IPC IPC(8): B23K31/02B23K37/00
CPCB23K31/02B23K2103/12
Inventor 王国建李海涛
Owner INST OF ELECTRONICS CHINESE ACAD OF SCI
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