Light-emitting diode

Abstract

The invention discloses a light-emitting diode. The light-emitting diode comprises a glass cover plate, a ceramic substrate, a light-emitting diode chip and a circuit structure layer. The ceramic substrate is provided with a groove. The shape of the glass cover plate is matched with the shape of the groove, and the glass cover plate covers the groove. The contact surface of the ceramic substrate and the glass cover plate is provided with a glaze layer. The contact surface of the glass cover plate and the groove is provided with a glass paste layer. The glass paste layer is used for welding theglass cover plate and the ceramic substrate together in a fusion way. The light-emitting diode chip is arranged in the groove, and the light-emitting diode chip is connected with the circuit structure layer. According to the light-emitting diode, the smooth glaze layer is manufactured on the surface of the ceramic substrate, and low temperature compact fusion welding of the glass cover plate andthe ceramic substrate is realized by using the glass paste so that the process complexity can be reduced, and the packaging air tightness and the reliability of the light-emitting diode can be enhanced.

Description

technical field [0001] The invention relates to the lighting field, in particular to a light emitting diode. Background technique [0002] Most of the existing LED lamps are packaged with epoxy resin and laser. On the one hand, epoxy resin is prone to aging under the conditions of ultraviolet light and high temperature, which affects the airtightness of LED packaging and light extraction efficiency. On the other hand, laser packaging is usually directly packaged with glass paste, or a metal layer is plated between the cover plate and the substrate, but the process of plating a metal layer on the surface of the ceramic substrate and glass cover plate is complicated and costly, and the metal layer The bonding force with the ceramic substrate and the glass cover is poor, and it is easy to fall off, which affects the airtightness and reliability of the device. Moreover, due to the roughness of the surface of the ceramic substrate and the existence of many voids, direct use of ...

AI Technical Summary

Problems solved by technology

On the one hand, epoxy resin is prone to aging under the conditions of ultraviolet light and high temperature, which affects the airtightness and light extraction efficiency of LED packaging.

On the other hand, laser packaging is usually directly packaged with glass paste, or a metal layer is plated between the cover plate and the substrate, but the process of plating a metal layer on the surface of the ceramic substrate and glass cover plate is complicated and costly, and the metal layer The bonding force with the ceramic substrate and glass cover is poor, and it is easy to fall off, which affects the airtightness and reliability of the device

Moreover, due to the roughness of the surface of the ceramic substrate and the existence of many voids, direct use of glass paste to realize the bonding of the ceramic substrate and the glass cover plate is easy to form voids, and the uneven distribution of the glass paste will also cause excessive local stress. Large, resulting in poor airtightness and reliability of the device

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