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Laminated circuit substrate and substrate manufacturing method

A technology for circuit substrates and wiring substrates, which can be used in multilayer circuit manufacturing, printed circuit manufacturing, printed circuits, etc., and can solve problems such as complex substrate manufacturing steps.

Active Publication Date: 2011-12-14
FUJITSU INTERCONNECT TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since the above technique of adjusting the amount of bonding resin according to the wiring patterns and lands formed on the surface of the substrate requires various bonding sheets according to substrates with different residual copper ratios, this technique requires complicated substrate manufacturing steps

Method used

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  • Laminated circuit substrate and substrate manufacturing method
  • Laminated circuit substrate and substrate manufacturing method
  • Laminated circuit substrate and substrate manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0017] Next, the configuration of the laminated circuit board according to the first embodiment will be described, then the lamination method for manufacturing the laminated circuit board will be described, and finally the effects of the first embodiment will be described.

[0018] Structure of laminated circuit board

[0019] Refer below figure 1 The configuration of the laminated circuit substrate 1 is described. figure 1 is a block diagram of the configuration of the laminated circuit board 1 according to the first embodiment. like figure 1 As shown, the laminated circuit substrate 1 includes a substrate 10A, a substrate 10B, a wiring pattern 11 , a bonding pad 12 , a conductive material 13 , a bonding layer 20 , a plate 30 and an adjustment via 31 .

[0020] The laminated circuit substrate 1 is a multilayer printed circuit substrate in which bonding pads 12 of both the substrate 10A and the substrate 10B are connected to each other by a conductive material 13 and two or...

no. 2 approach

[0040] Although in the first embodiment, the substrates are laminated with the bonding layer, and then the board is inserted between the substrates, other embodiments are also allowed. It is allowed to first form a bonding layer on a board, thereby obtaining a layer part, and then laminate the layer part on the substrate.

[0041] In the following second embodiment, a substrate is laminated with a layer member manufactured by forming a bonding layer on a board. refer to Figure 3 to Figure 5 The layer member of the laminated circuit substrate and the manufacturing method of the layer member according to the second embodiment will be described. image 3 is a schematic diagram of a layer component. Figure 4 is a schematic illustration of a layer component filled with conductive material. Figure 5 is a schematic diagram showing a method of manufacturing a laminated circuit board according to the second embodiment.

[0042] Such as image 3 As shown, the layer part is produ...

no. 3 approach

[0051] The present invention is not limited to the first embodiment and the second embodiment, and can be embodied in various ways. Other Embodiments The following is described as a third embodiment.

[0052] (1) layer parts

[0053] Although in the second embodiment, one bonding layer 20 of the layer members has holes at positions corresponding to the adjustment through holes 31 and the other bonding layer 20 has no holes, the configuration is not limited thereto. The adjustment via hole 31 is allowed to be formed on both bonding layers.

[0054] More specifically, by laminating the polyester film 21 , then laminating the bonding layer 20 , then the plate 30 , then the bonding layer 20 , and finally the polyester film 21 in the same manner as the layer members in the second embodiment, it is produced Figure 6 The layer part shown in . Each of the upper bonding layer 20 and the lower bonding layer has a hole at a position corresponding to the adjustment through hole 31 of ...

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PUM

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Abstract

A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; anda plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking.

Description

technical field [0001] Embodiments discussed herein relate to laminated circuit substrates and substrate manufacturing methods. Background technique [0002] Known compositional processes for manufacturing multilayer printed circuit boards include additive processes and semi-additive processes in which conductor patterns are formed on insulating plates. As the number of layers increases, in order to reduce processing steps and prevent a significant drop in yield, the above-described substrate manufacturing method uses a lamination technique that combines separately manufactured substrate layers together with conductive materials and the like in one process. [0003] More specifically, a conductive material of molten metal is supplied into via holes formed on the bonding layer, and then heat and pressure are applied to a plurality of substrates, thereby laminating a plurality of layers. During this process, the bonding sheet is softened due to the temperature rise, and the v...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K3/40H05K3/4069H05K1/11H05K2203/061H05K2203/063H05K1/02H05K3/46H05K3/4614Y10T29/49165
Inventor 吉村英明
Owner FUJITSU INTERCONNECT TECH LTD