A multilayer circuit board method combining high-density interconnection and high reliability
A high-density interconnection and multi-layer circuit board technology, which is applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of circuit board products that are prone to various failures and the rate of change of circuit board resistance.
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[0040] A multilayer circuit board method combining high-density interconnection and high reliability, comprising the steps of:
[0041] Step 1: Cutting the material, and cutting out the circuit board surface that meets the design requirements;
[0042] Step 2: Paste the dry film, and paste the dry film on each layer of the inner layer;
[0043] Step 3: transfer the graphics on the inner layer, using film exposure technology to transfer the graphics on the inner layer to the board;
[0044] Step 4: Graphic etching, use etching potion to etch away all unnecessary positions, and keep the required positions.
[0045] Step 5: Remove the dry film, remove all the pasted dry film, and expose the copper surface and the circuit;
[0046] Step 6: Graphic inspection, use a scanning instrument to check out the open and short circuit defects of the circuit;
[0047] Step 7: Browning, roughening the copper surface and wire surface of each layer of the inner layer, so as to make a good com...
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