Multilayer circuit board method with high density interconnection and high reliability combination
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A high-density interconnection, multi-layer circuit board technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of large resistance change rate of circuit boards and various failures of circuit board products.
Inactive Publication Date: 2013-04-03
ZHONGSHAN DAJIN ELECTRONICS
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[0002] With the economic development of the society, the same product can be sold all over the world. Due to the different environments and climates in different places, the existing circuit board products can no longer adapt to the influence of the environment and climate. After the hot oil test, the resistance change rate of the circuit board is very large, and the circuit board products are prone to various failures. Therefore, high reliability testing has become a difficult problem in the circuit board product industry. High-end products (high-density interconnection) coupled with strict After the reliability test, it is a difficulty that has not been broken through in the industry
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[0040] A method for manufacturing a multilayer circuit board combined with high-density interconnection and high reliability, comprising the steps of:
[0041] Step 1: Cutting the material, and cutting out the circuit board surface that meets the design requirements;
[0042] Step 2: Paste the dry film, and paste the dry film on each layer of the inner layer;
[0043] Step 3: transfer the graphics on the inner layer, using film exposure technology to transfer the graphics on the inner layer to the board;
[0044] Step 4: Graphic etching, use etching potion to etch away all unnecessary positions, and keep the required positions.
[0045] Step 5: Remove the dry film, remove all the pasted dry film, and expose the copper surface and the circuit;
[0046] Step 6: Graphic inspection, use a scanning instrument to check out the open and short circuit defects of the circuit;
[0047] Step 7: Browning, roughening the copper surface and wire surface of each layer of the inner layer, ...
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Abstract
The invention discloses a multilayer circuit board manufacturing method with high density interconnection and high reliability combination. The method comprises the following steps of: rough shape cutting, sticking of dry film, transferring of inner layer patterns, etching of patterns, removing of a dry film, inspecting of patterns, brownification, stitching of a laminate, stitching, boring and burying, copper deposition, electrifying of the board, sticking of the dry film, transferring of patterns, electroplating of patterns, etching of patterns, brownification, stitching of laminated, stitching, copper deposition, electrifying of the board, sticking of the dry film, transferring of patterns, electroplating of patterns, etching of patterns, inspecting of patterns and molding. The invention aims to provide a multilayer circuit board method, after the cold and heat impulsion and the hot-oil high reliability testing, the resistance change rate is small, and the failure of the circuit board product is not easy to occur.
Description
[technical field] [0001] The invention relates to a method for manufacturing a multilayer circuit board combined with high density interconnection and high reliability. [Background technique] [0002] With the economic development of the society, the same product can be sold all over the world. Due to the different environments and climates in different places, the existing circuit board products can no longer adapt to the influence of the environment and climate. After the hot oil test, the resistance change rate of the circuit board is very large, and the circuit board products are prone to various failures. Therefore, high reliability testing has become a difficult problem in the circuit board product industry. High-end products (high-density interconnection) coupled with strict After the reliability test, it is a difficult point that has not been broken through in the industry. [Content of the invention] [0003] The present invention overcomes the disadvantages of th...
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Application Information
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