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Breaking device

A breaking device and scoring line technology, which is applied in the field of unit product devices, can solve problems such as inconvenience

Inactive Publication Date: 2014-03-12
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] It can be seen that the above-mentioned existing breaking device obviously still has inconvenience and defects in structure and use, and needs to be further improved urgently.

Method used

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Embodiment Construction

[0064] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, characteristics and effects of the breaking device proposed according to the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments. The description is as follows.

[0065] Hereinafter, the breaking device of the present invention will be described in detail based on the drawings. Here, an example of an electronic component divided into unit elements along scribed lines on an LTCC substrate (low temperature fired ceramic substrate) integrally molded by distributing a plurality of electronic components in a grid pattern will be described here based on the drawings.

[0066] (Embodiment 1)

[0067] Figure 1-Figure 6 A diagram of the first embodiment is shown. The LTCC substrate 1 divided by the present invention is attached to a...

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PUM

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Abstract

The invention relates to a breaking device, including the following: a fragile material substrate 1 with a score line S at the surface and an absorbing platform 10; a substrate loading and locating surface formed on the absorbing platform 10, and the score line S of the substrate is loaded and located at the opening 9 at the nearby upper portion; a pair of breaking rods 4, 4' arranged left and right over the score line S, pressing the fragile material substrate; and a lower portion breaking rod 5 arranged below the score line S, supporting the fragile material substrate 1 and breaking the fragile material substrate. The lower portion breaking rod 5 is movably accommodated in the front opening 9, and is protruded from the opening 9 when broken from the substrate. A three-point bending mode is provided for fixing the substrate when the fragile material substrate is broken, the substrate deviation is prevented, and breaking can be carried out along the score line accurately.

Description

technical field [0001] The present invention relates to a method for breaking substrates made of brittle materials such as glass, silicon, ceramics, and compound semiconductors. In particular, it relates to a device for dividing a substrate into unit products such as chips along a plurality of scribe lines formed in a rectangular shape or a lattice shape on the substrate. Background technique [0002] In the past, it is known to use a dicing saw, a knife wheel, and a laser beam to form a plurality of scribe lines on a brittle material substrate, and then apply an external force to bend the substrate and break along the scribe lines to take out products such as chips (for example, patent Literature 1, etc.). [0003] Figure 20 It is a perspective view showing an example of a case where a laser beam is used to form scribe lines on the substrate 21 on the stage 20 . By scanning the beam spot of the laser optical system 23 with the scanning mechanism 22 along the planned scri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02B28D1/22B28D5/04B28D7/02
CPCC03B33/03C03B33/033C03B33/037C03B33/10Y02P40/57
Inventor 冈岛康智
Owner MITSUBOSHI DIAMOND IND CO LTD