Unlock instant, AI-driven research and patent intelligence for your innovation.

Shock-resistant heat-dissipating electronics packaging

An electronic device and packaging technology, which is applied in the field of shock-resistant and heat-dissipating electronic device packaging, can solve problems such as magnified impact

Inactive Publication Date: 2016-01-06
PRAD RES & DEV LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In other words, heat dissipation techniques may amplify the impact induced on the electronics

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Shock-resistant heat-dissipating electronics packaging
  • Shock-resistant heat-dissipating electronics packaging
  • Shock-resistant heat-dissipating electronics packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] Embodiments are described herein with reference to a particular shock-resistant heat-dissipating electronics packaging type. For example, the embodiments focus on advanced electronics packaging for use in conjunction with downhole bridging or other types of well isolation mechanisms. However, a variety of applications for use in an oilfield environment or outside can take advantage of the unique combination of shock and heat dissipation characteristics of electronics packages as detailed herein. In fact, this type of packaging can be beneficial wherever electronic devices are subjected to ultra-high temperature and shock environments. In any event, embodiments of the electronics package detailed herein include a plurality of chassis having ramped surfaces engaged such that application of an actuation force causes the chassis to expand radially toward the vicinity of the housing. As a result, a nearly monolithic structure is formed, which is substantially enhanced in te...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electronic device package of substantially monolithic construction. The package is particularly good at enhancing heat dissipation and avoiding secondary shocks when placed in harsh application environments. Accordingly, the package may be particularly well suited for use in connection with high impact downhole applications such as bridge plug setting.

Description

technical field [0001] The embodiments relate to electronics packaging. In particular, it concerns packaging that will be exposed to a great deal of heat and shock. More specifically, this article details packages used in high temperature downhole environments and subjected to shocks of hundreds of g's. Background of the invention [0002] Exploring, drilling, and completing oil and gas wells and other wells are often complex, time-consuming, and ultimately prohibitively expensive endeavors. As a result, a great deal of emphasis has been placed on overall well configuration, monitoring and following interventional maintenance. Indeed, perhaps even more emphasis has been directed towards minimizing costs associated with applications that facilitate well formation, monitoring and maintenance. In conclusion, paying close attention to the cost-effectiveness and reliable execution of these applications can help maximize production and extend well life. As a result, substantia...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): E21B47/017E21B47/01
CPCY10T29/49938E21B47/017E21B47/0175
Inventor R·马丁内斯A·迪亚斯
Owner PRAD RES & DEV LTD