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Thermally enhanced light emitting device package

A technology for light-emitting devices and heat sinks, applied in electrical components, electrical solid-state devices, circuits, etc., can solve the problems of reduced lifespan, increased packaging volume, weight and cost of light-emitting diodes, and decreased brightness of high-power light-emitting diodes

Inactive Publication Date: 2012-11-28
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the higher heat energy generated by high-power LEDs, the general heat sink cannot effectively dissipate more heat, resulting in a decrease in the brightness and life of high-power LEDs.
Therefore, a more complex heat dissipation design is required to assist heat dissipation. Relatively, a complex heat dissipation design will increase the volume, weight and cost of the LED package

Method used

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  • Thermally enhanced light emitting device package
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  • Thermally enhanced light emitting device package

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Embodiment Construction

[0017] figure 1 A schematic cross-sectional view of the heat dissipation-enhanced light-emitting device 10 according to the first embodiment of the present invention is shown. figure 2 A schematic cross-sectional view of a light emitting device 20 for improving heat dissipation according to a second embodiment of the present invention is shown. refer to figure 1 and figure 2 As shown, the light-emitting device 10 or 20 for improving heat dissipation includes a lead frame 13, a chip 12, a plurality of metal wires 15, a sealant 14 and a plurality of non-electrically conductive carbon nanocapsules (non-electrically conductive carbon nanocapsules) 16, wherein The chip 12 is fixed on the lead frame 13; a plurality of metal wires 15 are electrically connected to the chip 12 and the lead frame 13; the sealant 14 is mixed with a plurality of non-conductive nano-carbon spheres 16 and covers the chip 12, the lead frame 13 and the plurality of metal wires Line 15.

[0018] Such as ...

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Abstract

A thermally enhanced light emitting device package includes a substrate, a chip attached to the substrate, an encapsulant overlaid on the chip, and a plurality of non-electrically conductive carbon nanocapsules mixed in the encapsulant to facilitate heat dissipation from the chip.

Description

technical field [0001] The present invention relates to a light emitting device, in particular to a light emitting device with high heat dissipation capability. Background technique [0002] Due to the advantages of low energy consumption and high lighting efficiency, light-emitting diodes (LEDs) are quickly used in many electronic products, such as: mobile devices, advertising light boxes, screens, signal lights, car turn signal lights, etc. As is well known, a large amount of heat is generated when an LED emits light. Therefore, a cooling device is required to assist in dissipating a large amount of heat energy. [0003] A traditional LED packaging structure mainly includes a heat sink, an LED chip disposed on the heat sink, and an encapsulant covering the LED chip. Thereby, the light emitted by the light-emitting diode is emitted outward through the package body. Because the package body is usually made of polymer material, since the thermal conductivity of the polymer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64
CPCH01L33/54H01L2224/32257H01L33/486H01L2224/49107H01L33/62H01L33/501H01L2224/48091H01L33/56H01L2224/73265H01L2224/48464H01L33/641H01L2224/48247H01L2924/00014
Inventor 刘安鸿蔡润波王伟
Owner CHIPMOS TECH INC