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Incision fixing fixture

A fixed fixture and positioning technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of unfavorable industrial development, expensive cutting and fixed fixtures, and long manufacturing time

Active Publication Date: 2014-11-05
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, cutting fixtures are expensive and take a long time to manufacture, which is not conducive to the development of a rapidly changing industry

Method used

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  • Incision fixing fixture
  • Incision fixing fixture
  • Incision fixing fixture

Examples

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Embodiment Construction

[0048] Please refer to figure 1 , which shows an exploded view of the cutting and fixing jig according to an embodiment of the present invention. The cutting and fixing fixture 100 includes a substrate carrier 110 , an insulating frame 120 and a conductive member 130 .

[0049] The substrate carrier 110 and the insulating frame 120 are independent components, which are formed separately and then joined together by snapping, locking, bonding, or other permanent or temporary methods. However, in another example, the insulating frame 120 and the substrate carrier 110 may be integrally formed. The material of the substrate carrier 110 can be metal, plastic or a material similar to the insulating frame 120 .

[0050] The substrate carrier 110 is fixed in the insulating frame 120 for carrying the substrate 140 to be cut ( image 3 ). The substrate carrier 110 has a plurality of suction channels 111 and a plurality of cutter letting grooves 112 , the cutter letting grooves 112 su...

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PUM

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Abstract

The invention relates to an incision fixing fixture which comprises an insulation frame, a baseplate load-bearing piece and an electric conduction piece, wherein the insulation frame is provided with an upper surface, and the baseplate load-bearing piece is arranged in the insulation frame and can bear the baseplate to be incised; and the electric conduction piece is arranged in the insulation frame and is provided with an incision reference surface, and the incision reference surface and the upper surface of the insulation frame are substantially parallel.

Description

technical field [0001] The present invention relates to a cutting and fixing jig, and in particular to a cutting and fixing jig for semiconductor cutting process. Background technique [0002] In the cutting process of semiconductor packaging units, it is often necessary to use an all-metal cutting fixture with a cutter to singulate the packaging substrate into several packaging units. However, cutting and fixing jigs are expensive and take a long time to manufacture, which is not conducive to the development of a rapidly changing industry. Contents of the invention [0003] The invention relates to a cutting and fixing jig. In one embodiment, the cutting and fixing jig is relatively cheap, and the manufacturing time is relatively short. [0004] According to the present invention, a cutting and fixing jig is proposed. The cutting and fixing jig includes an insulating frame, a substrate carrier and a conductive part. The insulating frame has an upper surface. The subst...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/78H01L21/683
Inventor 李相润张敬模
Owner ADVANCED SEMICON ENG INC