Heat pump hot-water supply device

A technology for hot water supply and heat pump, which is applied in the detection and prevention of scale adhesion, and can solve problems such as blocked water pipes, inability to operate heat pump water supply machines, and reduced heating capacity of heat pump water supply machines

Inactive Publication Date: 2013-02-06
HITACHI APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When hard cores adhere to the inner surface of the water pipe, scale grows and accumulates, reducing the heating capacity of the heat pump water heater
In addition, when the growth and accumulation of scale develop, the water piping is blocked, and the operation of the heat pump water heater cannot be performed.

Method used

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  • Heat pump hot-water supply device
  • Heat pump hot-water supply device
  • Heat pump hot-water supply device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach 》

[0055] figure 1 It is a structural schematic diagram of the heat pump water heater of 1st Embodiment.

[0056] The heat pump water heater includes a heat pump unit 30 that accommodates a constituent part of the heat pump refrigerant circuit and a constituent part of the liquid circuit to be heated, and a liquid storage unit 40 that houses the other constituent parts of the liquid circuit to be heated and a constituent part of the liquid supply circuit. , an operation control unit 51 for controlling the liquid storage unit 40 , an operation control unit 52 for controlling the heat pump unit 30 , and a remote control 50 serving as an interface to the user. In addition, the remote control 50, the operation control means 51, and the operation control means 52 are communicably connected.

[0057] Next, the configurations of the heat pump refrigerant circuit, heated liquid circuit, and liquid supply circuit will be described.

[0058]

[0059] The heat pump refrigerant circuit i...

no. 2 approach 》

[0163] Second, use Figure 8 and Figure 9 A heat pump water heater according to a second embodiment will be described.

[0164] Figure 8 It is a structural schematic diagram of the heat pump water heater of 2nd Embodiment.

[0165] The heat pump water heater of the second embodiment (refer to Figure 8 ) to replace the heat pump water supply machine of the first embodiment (refer to figure 1 ) water-refrigerant heat exchanger 2 includes: a low-temperature-side water-refrigerant heat exchanger 2A, a high-temperature-side water-refrigerant heat exchanger 2B, a refrigerant connection pipe 3a, and a water connection pipe 3b.

[0166] The refrigerant discharged from the compressor 1 flows into the refrigerant-side heat transfer tube 2Ba of the high-temperature side water-refrigerant heat exchanger 2B to exchange heat with the water-side heat transfer tube 2Bb, and flows into the low-temperature side water refrigerant through the refrigerant connecting pipe 3a. The refrigeran...

no. 3 approach 》

[0173] Second, use Figure 10 and Figure 11 A heat pump water heater according to a third embodiment will be described.

[0174] The difference between the heat pump water heater of the third embodiment and the heat pump water heaters of the first embodiment and the second embodiment lies in the determination method of scale deposition.

[0175] The heat pump water heater of the third embodiment includes an inlet water temperature sensor 21 that detects the water temperature on the inlet side of the water-refrigerant heat exchanger 2 , and an outlet sensor 21 that detects the water temperature (warm water) on the outlet side of the water-refrigerant heat exchanger 2 . The hot water temperature sensor 20 and the water pipe temperature sensor 24 provided in the middle of the water pipes of the water-refrigerant heat exchanger 2 determine scale deposition.

[0176] Figure 10 It is a graph explaining the determination of scale deposition in the heat pump water heater accordin...

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PUM

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Abstract

Provided is a heat pump hot-water supply device capable of determining whether scale is deposited. Specifically disclosed is a heat pump hot-water supply device provided with a heat pump refrigerant circuit which is configured by connecting at least a compressor (1), a refrigerant-side heat transmission tube (2a) of a liquid refrigerant heat exchanger (2), a pressure reduction unit (4), and an air heat exchanger (5) by refrigerant piping, a liquid-to-be-heated circuit which is configured by connecting at least a pump (15) and a liquid-side heat transmission tube (2b) of the liquid refrigerant heat exchanger (2) by liquid piping, a first temperature sensor (20) which detects the temperature of a liquid to be heated on the outlet side of the liquid refrigerant heat exchanger (2), and an operation control means (52); which controls the heat pump refrigerant circuit and/or the liquid-to-be-heated circuit to perform a liquid heating operation, said heat pump hot-water supply device being provided with a second temperature sensor (24) which detects the temperature of the liquid to be heated on the upstream side from the liquid to be heated the temperature of which is detected by the first temperature sensor (20).

Description

technical field [0001] The invention relates to a heat pump water supply machine, in particular to the detection and prevention of scale adhesion. Background technique [0002] Heat pump water heaters are usually the following hot water storage type heat pump water supply machines. Using the discounted electricity bills at night to operate the heat pump and pump, the normal temperature water (heated liquid) is heated to form high temperature water (high temperature heated liquid) and Stored in a liquid storage tank, when the tap is turned on during the day when hot water is used, the high-temperature water in the liquid storage tank is mixed with normal temperature water to make moderate temperature water for hot water supply. [0003] In addition, the boiling temperature of the water in the heat pump operation of the heat pump water heater is usually about 65°C (the (company) Japan Refrigeration and Air Conditioning Industry Standard (JRA4050:2007R) standard boiling tempera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F24H1/00
CPCF24D2200/123F24D19/0092F24D2220/04F24D17/02F24D2220/08F24D19/1054F24D2240/26F24H1/00F24H4/00F24H4/02F24H9/20F24H15/38F24H15/281F24H15/20F24H15/395F24H15/219F24H15/258F24H15/242F24H15/375F24H15/215F24H15/288F24H15/227F24H15/45
Inventor 榎津丰杉山和一村山昌巳
Owner HITACHI APPLIANCES INC
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