Cooling device and buckle thereof
A technology of heat sink and fastener, applied in cooling/ventilation/heating transformation, etc., can solve the problems of large area of heat absorbing plate, poor contact between heat absorbing plate and circuit board, warping and so on
Inactive Publication Date: 2013-06-05
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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Problems solved by technology
However, since the heat-absorbing plate contacts the main chip and the components around the main chip at the same time, the area of the heat-absorbing plate is relatively large, and the traditional buckle generally only presses the part of the heat-absorbing plate on the main chip, which may easily cause the heat-absorbing plate to resist The other parts of the surrounding components that press the main chip are warped due to the reaction force, which leads to poor contact between the entire heat sink and the circuit board
Method used
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[0014] see figure 1 , shows the heat dissipation device 100 of the present invention. The heat dissipation device 100 includes a fin set 10 , a fan 20 , a heat pipe 30 , a heat absorption plate 40 and a fastener 50 for fixing the heat pipe 30 and the heat absorption plate 40 on the surface of the electronic component. The fan 20 is located on one side of the fin set 10 for blowing air to the fin set 10 . The heat-absorbing plate 40 is used for contacting with the heating main chip 61 and the additional electronic component 62, one end of the heat pipe 30 is connected with the fin set 10, and the other end is connected with the heat-absorbing plate 40, and the buckle 50 is used for connecting the heat-absorbing The heat plate 40 and the heat pipe 30 are connected together and the heat absorbing plate 40 is locked on the heat-generating main chip 61 and the additional electronic component 62 of the circuit board 60 . The fin set 10 is composed of a plurality of heat dissipatio...
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The invention provides a cooling device which is used for cooling electronic elements installed on a circuit board. The cooling device includes a fin group, a heat absorbing board and a buckle, wherein the buckle is used for fixing the heat absorbing board on the surface of each electronic element. The heat absorbing board includes a chip pressing part used for contacting a first electronic element and an element pressing part used for contacting a second electronic element. The buckle includes a fixing part, an end part formed on the fixing part and an extension part formed on the end part. The extension part forms an abutting part towards the circuit board, the fixing part abuts against the chip pressing part of the heat absorbing board, the abutting part abuts against the element pressing part of the heat absorption board, so that the heat absorption board is buckled on the circuit board by the parts commonly. Due to the fact that the buckle is provided with the extension part, when the buckle is fixed on the heat absorbing board, the chip pressing part and the element pressing part of the heat absorbing board can be stressed at the same time, the influence that one part is stressed only so that counter-force of the other part happens and the other part is turnup can be effectively prevented. The invention further provides a buckle used for the cooling device.
Description
technical field [0001] The invention relates to a heat dissipation device, in particular to a buckle for fixing the heat dissipation device. Background technique [0002] With the rapid development of the computer industry, more and more heat is generated by heat-generating electronic components such as micro-processing chips. components to dissipate heat. In current computers and many electronic products, the main chip and the surrounding electronic components are designed to be bonded, using fasteners to press the heat-absorbing plate on the electronic components to generate enough pressure to achieve a good relationship between the heat pipe of the heat sink and the electronic components. The heat transfer, and then meet the heat dissipation requirements. However, since the heat-absorbing plate contacts the main chip and the components around the main chip at the same time, the area of the heat-absorbing plate is relatively large, and the traditional buckle generally ...
Claims
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IPC IPC(8): H05K7/20
Inventor 陈金贤
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD