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A method for improving the uniformity of distribution of phosphor powder in LED packaging

A uniform distribution and LED packaging technology, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as uneven distribution of phosphor powder, achieve the effect of improving light color yield and eliminating external electric field

Inactive Publication Date: 2016-04-27
上舜电子科技(中国)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: the uneven distribution of phosphor powder due to the free phosphor powder

Method used

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  • A method for improving the uniformity of distribution of phosphor powder in LED packaging
  • A method for improving the uniformity of distribution of phosphor powder in LED packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1 Traditional LED Packaging Method

[0023] Such as figure 1 , the current basic process of COB packaging is: a, solid crystal, the chip 5 is fixed on the light source substrate 2, wherein the circuit layer and reflective layer are arranged on the substrate as usual, and the chip is fixed on the reflective layer; b, wire bonding, according to Design requirements, use gold wires to connect the circuits between the chips, the circuit connection mode is series or parallel or mixed connection, and connect the chip circuit with the positive and negative electrodes of the printed circuit layer on the substrate; c. Coating phosphor, soldering Place the qualified light source semi-finished product on the glue dispensing fixture 1, and then apply fluorescent glue on the glue coating area 4; d, bake and cure, put the light source semi-finished product coated with fluorescent glue into the oven to bake; During the process, due to the intrinsic absorption of the ligh...

Embodiment 2

[0024] Embodiment 2 LED encapsulation method provided by the present invention

[0025] In order to overcome the above-mentioned technical problems, the present invention provides a method for improving LED light source packaging, which includes the following steps: a. Die bonding, fixing the chip 5 on the light source substrate 2, wherein the substrate 2 is conventionally provided with a circuit layer and a reflective layer , the chip 5 is fixed on the reflective layer; b, wire bonding, according to the design requirements, connect the circuit between the chips 5 with a gold wire, the circuit connection mode is series or parallel or mixed connection, and the chip circuit and the printed circuit on the substrate The positive pole 3 of the layer is connected to the negative pole 6 of the printed circuit layer; c, short-circuit the positive and negative poles, the short-circuit probe 8 is set on the positive pole 3 of the printed circuit layer and the negative pole 6 of the pri...

Embodiment 3

[0029] Embodiment 3 LED packaging method provided by the present invention

[0030] The difference from Example 1 is that: the substrate is made of aluminum substrate; the phosphor is made of Mitsubishi BG201 silicate powder; the encapsulation glue is made of epoxy resin; the baking temperature is 60° C.; the baking time is 5 minutes.

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Abstract

The invention belongs to the field of semiconductor lighting, and in particular relates to a method for improving LED packaging. The method comprises the following steps: fixing the LED chip on a substrate containing a printed circuit layer; connecting the negative pole of the chip to the negative pole of the printed circuit layer of the substrate, connecting the positive pole of the chip to the positive pole of the printed circuit layer of the substrate, and then connecting the positive pole of the printed circuit layer of the substrate to the positive pole of the printed circuit layer of the substrate. The printed circuit layer is connected to the negative electrode; the positive electrode and the negative electrode of the printed circuit layer are short-circuited; the mixture of phosphor and silica gel is prepared according to the proportion, and after stirring, it is coated on the chip; the semi-finished light source is put into an oven for baking. The method for improving LED light source packaging provided by the present invention, by short-circuiting the positive and negative poles of the substrate to make them at the same potential difference, eliminates the "external electric field" generated by the intrinsic absorption of the light-emitting diode, and achieves the purpose of uniform distribution of phosphor powder, nearly Thus, the light and color yield of the light source product is improved.

Description

technical field [0001] The invention belongs to the field of semiconductor lighting, and in particular relates to a method for improving LED packaging. Background technique [0002] Semiconductor light-emitting diodes (LEDs) have the characteristics of high brightness, energy saving, environmental protection, long life, and fast response. As a new type of solid light source, they have been widely used in the field of lighting—bulb lamps, fluorescent lamps, downlights, etc. [0003] The light-emitting principle of light-emitting diodes is: under the action of an external electric field, electrons in the conduction band transition to the valence band and recombine with holes to generate spontaneous emission light. According to the characteristics of semiconductor light-emitting materials, there is a reverse process of transition radiation light--- - Intrinsic absorption, the band gap of the semiconductor material is Eg, and its peak wavelength λ≈1240 / Eg (mm), under the irradia...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/50H01L33/56
Inventor 潘善峰杨国杰王劲黄精文
Owner 上舜电子科技(中国)有限公司