Preparation method of metal chalcogenide film

A metal chalcogenide, thin film technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the problem that the thickness of molybdenum disulfide thin film is difficult to precisely control, random limits large-scale integrated production, size , uncontrollable position and thickness, etc., to achieve the effect of simple method, good crystal quality and good electrical properties

A metal chalcogenide, thin film technology, applied in metal material coating process, gaseous chemical plating, coating and other directions, can solve the problem that the thickness of molybdenum disulfide thin film is difficult to precisely control, random limits large-scale integrated production, size , uncontrollable position and thickness, etc., to achieve the effect of simple method, good crystal quality and good electrical properties

CN103194729BActive Publication Date: 2015-09-02INST OF PHYSICS - CHINESE ACAD OF SCI

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  • Preparation method of metal chalcogenide film
  • Preparation method of metal chalcogenide film
  • Preparation method of metal chalcogenide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] The sulfur powder and molybdenum trioxide are 30mg and 0.3g respectively, the evaporation temperature is 120°C and 500°C respectively, the deposition temperature of silicon dioxide is 750°C, the air pressure is 1.39torr, and the growth time is 15min.

Embodiment 2

[0060] The sulfur powder and molybdenum trioxide are 50mg and 0.3g respectively, the evaporation temperature is 120°C and 530°C respectively, the deposition temperature of silicon dioxide is 750°C, the air pressure is 1.39torr, and the growth time is 20min.

Embodiment 3

[0062] The sulfur powder and molybdenum trioxide are 50mg and 0.4g respectively, the evaporation temperature is 120°C and 530°C respectively, the deposition temperature of silicon dioxide is 750°C, the air pressure is 1.39torr, and the growth time is 40min.

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Abstract

The invention discloses a method for preparing a metal chalcogenide film. The method is used for growing the metal chalcogenide film on a substrate with the vapor deposition process by using a chalcogen source and a metal element source and comprises the following steps of: providing three temperature zones, wherein the temperature of the three temperature zones can be controlled independently, and the chalcogen source, the metal element source and the substrate are put in the three temperature zones respectively; controlling the three temperature zones, evaporating the chalcogen source to generate the chalcogen source steam, evaporating the metal element source to generate the metal element source steam, and heating the substrate to the predetermined deposition temperature; providing a carrier gas, and enabling the carrier gas to flow through the three temperature zones in sequence to deliver the metal element source steam to the substrate to deposit and grow so as to form the metal chalcogenide film. The method disclosed by the invention is simple, dispenses with the original complex step of introducing a nucleation site and effectively ensures the purity and the surface cleanness of a sample. The metal chalcogenide film prepared by adopting the method has high quality.

Description

technical field [0001] The invention relates to the field of preparation of nanometer materials, in particular to a preparation method of a metal chalcogenide thin film. Background technique [0002] The two-dimensional material graphene has aroused a research boom in the scientific field due to its excellent physical properties and high mobility. However, since graphene is a zero-bandgap material, graphene-based field effect transistors cannot be effectively turned off and the current switching ratio is very low. Although researchers have tried to open its bandgap through many methods, so far, the largest bandgap obtained is only a few hundred meV, which limits its wide application in large-scale integrated transistors and logic circuits. [0003] Recently, people have turned their attention to another class of 2D materials—transition metal chalcogenides (TDMCs). The general molecular structure formula of this type of material can be expressed as MX 2 (M is a transition ...

Claims

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Application Information

Patent Timeline
02 Sep 2015
Publication
CN103194729B
IPC
C23C16/30; C23C16/46; C23C16/52
Inventors
张广宇; 时东霞