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Electromagnetic scattering analyzing method for superspeed flight targets

A flying target, electromagnetic scattering technology, applied in electrical digital data processing, instruments, computing and other directions, can solve the problems of large unknown quantities and high consumption of computing resources

Active Publication Date: 2013-07-10
NANJING UNIV OF SCI & TECH
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  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

Due to the large amount of unknowns caused by the volume division of the plasma shell, even if the part with a relative permittivity close to 1 is treated as air, it still faces the problem of high consumption of computing resources

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  • Electromagnetic scattering analyzing method for superspeed flight targets
  • Electromagnetic scattering analyzing method for superspeed flight targets
  • Electromagnetic scattering analyzing method for superspeed flight targets

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Embodiment Construction

[0050] The electromagnetic scattering analysis method of the ultra-high-speed flying target of the present invention, the steps are as follows:

[0051] The first step is to establish the model of the high-speed flying target and the plasma shell, mainly the determination of the electromagnetic parameter model of the plasma shell, which is related to the flying environment of the high-speed flying target, such as flying altitude, flying speed, and atmospheric pressure and temperature around the flying target Wait.

[0052] The second step is grid processing. Triangulation is used for metal parts and tetrahedralization is used for plasma sheath parts.

[0053] The third step is to establish the volume integral equation. According to the scattering characteristics of the hybrid structure, the total field on the target is equal to the sum of the incident field and all the scattered fields. The incident electric field is a known excitation. A uniform plane wave is usually used a...

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Abstract

The invention discloses an electromagnetic scattering analyzing method for superspeed flight targets. For non-uniform characteristics of plasmas around the superspeed flight targets, a part of equivalent relative dielectric constant, approximate to one, of the plasmas is used as the air to be processed by analyzing through a volume-surface integer equation, and areas with larger equivalent relative dielectric constant are encrypted by the adaptive network so as to achieve required solving accuracy. By adopting conventional method of uniform grid subdivision plasma casing, the electromagnetic scattering analyzing method can greatly save computing resources, green function adopted in the volume-surface integer equation is green function in vacuum, multilayer speedy multi-step ion technology is used for accelerating solving, so that fewer internal memory and shorter computing time are required for solving the problem of scattering of the superspeed flight targets.

Description

technical field [0001] The invention belongs to the rapid calculation technology of target electromagnetic scattering characteristics, in particular to an electromagnetic scattering analysis method applied to ultra-high-speed flying targets. Background technique [0002] Due to the high flight speed (above Mach 3) and high flight altitude (above 20Km) of the ultra-high-speed flying target, the friction with the air during its flight will generate aerodynamic heat of several thousand degrees Celsius, making the surrounding air appear ionized. The ionic state exists. When the degree of ionization reaches a certain level, the ionized gas has plasma properties. At this time, the enveloping flow field near the surface of the flying target is usually called plasma enveloping flow field, re-entry plasma or plasma sheath, which means that the flying target is covered by plasma (normal rain, supersonic speed / Numerical Simulation of Hypersonic Plasma Flow Field and Research on Elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F19/00
Inventor 陈如山樊振宏丁大志陶诗飞盛亦军陈峰呼延龙沙侃叶晓东
Owner NANJING UNIV OF SCI & TECH
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