Inter-plate serial communication system and inter-plate serial communication method

A serial communication and inter-board technology, applied in transmission systems, digital transmission systems, electrical components, etc., can solve problems such as complex design and low communication reliability, reduce physical wiring, reduce backplane wiring pressure, The effect of reducing the stress of single-board wiring

Active Publication Date: 2013-07-10
武汉中软通科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The invention proposes an inter-board serial communication system and method, which solves the defects of low communication reliability and complicated design in the prior art; the invention has simple design, high communication reliability, and high communication efficiency

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  • Inter-plate serial communication system and inter-plate serial communication method
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  • Inter-plate serial communication system and inter-plate serial communication method

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Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] refer to Figure 1 to Figure 4 , a serial communication system 1 between boards, which includes a sending module 2 and a receiving module 3, the sending module 2 is signal-connected to the receiving module 3; the sending module includes a sending data buffer module and a sending data encoding module, The sending data buffering module is connected with the sending data encoding module; the receiving module includes a receiving data dynamic sampling modul...

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Abstract

An inter-plate serial communication system comprises a transmitting module and a receiving module, wherein the transmitting module is connected with the receiving module through signals. The transmitting module comprises a transmitted data buffer module and a transmitted data encoding module, wherein the transmitted data buffer module is connected with the transmitted data encoding module through signals. The receiving module comprises a received data dynamic sampling module, a received data decoding module and a received data buffer module, wherein the received data dynamic sampling module is connected with the received data decoding module through signals, and the received data decoding module is connected with the received data buffer module through signals. The transmitted data buffer module comprises a buffer queue module and a transmission control state machine. The inter-plate serial communication system is simple in design, high in communication reliability and communication efficiency, and free of time sequence pressure.

Description

technical field [0001] The invention relates to an inter-board serial communication system and method, in particular to an inter-board serial communication system and method without an associated clock. Background technique [0002] At present, most large-scale communication equipment (such as transmission network equipment, wireless base station equipment, core network equipment, power system control equipment, etc.) include main boards, service boards, dispatching boards, etc. with different functions, and the wiring between each board is through the backplane for data communication. [0003] In some scenarios, faster data communication between boards is required to transmit configuration or other data and control information. Specifically, for example, in a transmission network device, DCN data communication needs to be performed between the mainboard FPGA and the service board FPGA. [0004] In the prior art, some use the Ethernet communication method, some use the SPI...

Claims

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Application Information

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IPC IPC(8): H04L12/861H04L1/00
Inventor 李熊雄王小伟杨文斌
Owner 武汉中软通科技有限公司
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