Stripping capacity evaluation method and stripping capacity evaluation system for stripping equipment
A technology of peeling ability and peeling equipment, used in photosensitive material processing, semiconductor/solid-state device testing/measurement, etc., can solve the problems of inability to monitor the peeling ability of peeling equipment, evaluation of peeling ability without peeling equipment, etc.
Inactive Publication Date: 2013-08-21
BOE TECH GRP CO LTD
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Problems solved by technology
[0005] The embodiment of the present invention provides a method for evaluating the peeling ability of the peeling equipment, so as to solve the problem that there is no method for evaluating the peeling ability of the peeling equipment in the prior art, and the problem that the peeling ability of the peeling equipment cannot be monitored
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[0020] The present invention uses stripping equipment to carry out photoresist stripping treatment on the test block coated with photoresist, wherein the curing degree value of the photoresist coated on the test block is different; the stripping effect is carried out on the test block after stripping treatment. Detection, according to the detection results of the stripping effect, and the corresponding relationship between the photoresist curing degree value and the stripping ability level, determine the stripping ability level of the stripping equipment; avoid the problem that the stripping ability of the stripping equipment cannot be monitored in the prior art, and determine The stripping ability of different stripping equipment, evaluate the stripping ability of the stripping equipment, determine whether the stripping ability of the stripping equipment changes, and monitor the stripping ability of the stripping equipment.
[0021] The embodiments of the present invention wil...
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The invention relates to the field of a displaying technology, in particular to a stripping capacity evaluation method and a stripping capacity evaluation system for stripping equipment. The stripping capacity evaluation method and the stripping capacity evaluation system can solve the problems in the prior art that the method for evaluating the stripping capacity of the stripping equipment does not exist, and the stripping capacity of the stripping equipment can not be monitored. The stripping capacity evaluation method includes a first step of carrying out photoresist stripping processing on test blocks coated with photoresist through utilization of the stripping equipment, wherein curing degree values of the photoresist coated on the test blocks are different, and a second step of carrying out stripping effect detection on the test blocks which are subjected to the stripping processing, and determining stripping capacity grades of the stripping equipment according to a stripping effect detection result and corresponding relation between the curing degree values of the photoresist and the stripping capacity grades. The stripping capacity evaluation method and the stripping capacity evaluation system solve the problem in the prior art that the stripping capacity of the stripping equipment can not be monitored, and achieve the evaluation on the stripping capacity of the stripping equipment and monitoring of the stripping capacity of the stripping equipment.
Description
technical field [0001] The invention relates to the field of display technology, in particular to an evaluation method and evaluation system for the peeling ability of a peeling device. Background technique [0002] In the substrate patterning process in the field of display technology, for example, in the manufacturing process of the array substrate of the liquid crystal display, the stripping ability of the stripping equipment to the photoresist coated on the array substrate has a direct impact on the quality of the array substrate. If the photoresist on the current layer of material is not peeled off completely and there is residue or the photoresist residue value exceeds the photoresist residue threshold, it will cause the next layer of coated material to precipitate at the remaining photoresist and form defects. [0003] The principle of stripping the photoresist on the array substrate by the stripping device is that the photoresist is dissolved by the stripping liquid ...
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IPC IPC(8): H01L21/66
CPCG03F7/42
Inventor 刘英伟陈宁
Owner BOE TECH GRP CO LTD