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Evaluation method and evaluation system of peeling ability of peeling equipment

A technology of stripping ability and stripping equipment, which is applied in the direction of photosensitive material processing, semiconductor/solid-state device testing/measurement, etc., and can solve the problems that the stripping ability of the stripping equipment cannot be monitored, and the stripping ability evaluation of the stripping equipment is not available.

Inactive Publication Date: 2015-09-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a method for evaluating the peeling ability of the peeling equipment, so as to solve the problem that there is no method for evaluating the peeling ability of the peeling equipment in the prior art, and the problem that the peeling ability of the peeling equipment cannot be monitored

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  • Evaluation method and evaluation system of peeling ability of peeling equipment
  • Evaluation method and evaluation system of peeling ability of peeling equipment
  • Evaluation method and evaluation system of peeling ability of peeling equipment

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Embodiment Construction

[0020] The present invention uses stripping equipment to carry out photoresist stripping treatment on the test block coated with photoresist, wherein the curing degree value of the photoresist coated on the test block is different; the stripping effect is carried out on the test block after stripping treatment. Detection, according to the detection results of the stripping effect, and the corresponding relationship between the photoresist curing degree value and the stripping ability level, determine the stripping ability level of the stripping equipment; avoid the problem that the stripping ability of the stripping equipment cannot be monitored in the prior art, and determine The stripping ability of different stripping equipment, evaluate the stripping ability of the stripping equipment, determine whether the stripping ability of the stripping equipment changes, and monitor the stripping ability of the stripping equipment.

[0021] The embodiments of the present invention wil...

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Abstract

A method and a system for evaluating a stripping capability of a stripping device and an evaluation member used in the method and system, so as to implement evaluation and monitoring of the stripping capability of the stripping device. The method comprises: performing photoresist stripping processing on at least two test blocks, comprising different curing degree values, of a photoresist (43) by using a stripping device (501); detecting stripping effects of the test blocks after stripping processing (502); and according to curing degree values and stripping effects of the test blocks of the photoresist (43), determining a stripping capability level of the stripping device (503). The evaluation system comprises a photoresist stripping module (601) and an evaluation module (602). An evaluation member used for evaluating a stripping capability of a stripping device comprises at least two test blocks, each test block is formed of a substrate (42) and a photoresist (43) coated on the substrate (42), and each test block of the photoresist (43) has a different curing degree value.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an evaluation method and evaluation system for the peeling ability of a peeling device. Background technique [0002] In the substrate patterning process in the field of display technology, for example, in the manufacturing process of the array substrate of the liquid crystal display, the stripping ability of the stripping equipment to the photoresist coated on the array substrate has a direct impact on the quality of the array substrate. If the photoresist on the current layer of material is not peeled off completely and there is residue or the photoresist residue value exceeds the photoresist residue threshold, it will cause the next layer of coated material to precipitate at the remaining photoresist and form defects. [0003] The principle of stripping the photoresist on the array substrate by the stripping device is that the photoresist is dissolved by the stripping liquid ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66
CPCG03F7/42
Inventor 刘英伟陈宁
Owner BOE TECH GRP CO LTD