Method and device for producing flexible substrate
A substrate and bottom plate technology, which can be used in printed circuit manufacturing, semiconductor/solid-state device manufacturing, electrical components, etc., and can solve the problem that the flexible substrate is not easy to peel off the bottom plate.
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[0067] The detailed features and advantages of the present invention are described in detail in the following embodiments. The content is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it accordingly, and is based on the content disclosed in this specification, the scope of patent application and the drawings. Anyone skilled in the art can easily understand the related objectives and advantages of the present invention. The following examples further illustrate the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.
[0068] In the following description, words such as first, second, and third are used to distinguish different elements, components, and regions in the drawings. These words are not used to limit the components, composition, and area. That is, without departing from the spirit and scope of the present invention, the first ele...
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