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Integrated Thermal Insert and Cooling Plate

A technology for cooling plates and components, applied in cooling. It can solve problems such as low efficiency and suboptimal heat conduction

Active Publication Date: 2017-08-11
EMERSON NETWORK POWER EMBEDDED COMPUTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This configuration is not optimal for heat transfer due to inefficiencies in contact with the cooling plate surface area less than optimal

Method used

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  • Integrated Thermal Insert and Cooling Plate
  • Integrated Thermal Insert and Cooling Plate
  • Integrated Thermal Insert and Cooling Plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0016] See figure 1 The chassis cooling system 10 includes a component board assembly 12 that frictionally engages with the cooling plate assembly 14 to establish conductive cooling of the electronic components of the component board assembly 12. The component board assembly 12 includes a plurality of component boards (for example, circuit boards), which generate heat during operation, which must be removed in order for the system to operate properly. In the example configuration, the plurality of component boards includes a first component board 16, a second component board 18, a third component board 20 and a fourth component board 22. Each of the first component plate 16, the second component plate 18, the third component plate 20, and the fourth component plate 22 is arranged in parallel with each other, and uses a plurality of alignment pins extending from an alignment ...

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PUM

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Abstract

A cooling system having integrated cold plate extending member and cold plate for an electronics enclosure includes a chassis having multiple heat producing boards positioned in side-by-side parallel configuration having successive ones of the boards separated by a cavity thereby defining multiple ones of the cavities. A cold plate assembly includes a base unit of a thermally conductive material. The cold plate assembly also includes multiple cold plate extending members connected to the base unit. Successive ones of the cold plate extending members are spaced to be slideably received in one of the cavities such that the cold plate extending member received between any two successive boards is in direct contact with both of the successive ones of the boards.

Description

Technical field [0001] The present disclosure relates to the use of cooling plate chassis to mount the cooling of electronic boards. Background technique [0002] This section provides background information related to the present disclosure, which is not necessarily prior art. [0003] Electronic components (such as boards and card holders) generate heat during operation, and this heat must be removed for normal operation. In the case where a plurality of plates are gathered in a chassis or cabinet, it is known to install the plates on a cooling plate, which removes heat by conduction. The existing cooling plate technology relies on having two independent components: the chassis and the cooling plate, which are connected together by bolts. The component plate is usually connected to a plate conduction frame that is wedged into the cooling plate to contact it, thereby providing contact for heat conduction as the only device. Since the surface area of ​​contact with the cooling p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20545
Inventor 苏珊娜·马里耶·王马丁·彼得·约翰·科尔内斯罗伯特·查尔斯·图福德
Owner EMERSON NETWORK POWER EMBEDDED COMPUTING