Diamond wire particle online quality inspection device based on machine vision

Abstract

The invention discloses a diamond wire particle online quality inspection device based on the machine vision. The quality inspection device comprises a single-shaft mechanical arm with a slide block moving along the axial direction of a diamond wire, wherein the slide block is provided with an optical displacement platform, and the optical displacement platform is provided with a microscope lens and a camera, which are matched with each other and used for photographing the diamond wire; a work station, a camera, a PLC (programmable logic controller) for controlling the single-shaft mechanical arm, a database server and a work station for processing an image of the diamond wire respectively form a data exchange network; the relative speed difference of the camera and the diamond wire is reduced by utilizing the conjugate movement of the mechanical arm and the diamond wire so as to improve the definition of the image, the collected image is processed and analyzed by utilizing the work station to obtain diamond wire particle statistics data, the collection and processing of the image can be completed when the diamond wire moves, the online quality inspection is realized, the detection speed is high, and the entire quality inspection process is automatically completed.

Description

technical field [0001] The invention relates to the field of detection of cutting wires, in particular to an online quality inspection device for diamond wire particles based on machine vision. Background technique [0002] Crystalline silicon is an important raw material for solar photovoltaic industry and semiconductor industry. Since crystalline silicon is a typical hard and brittle material, diamond wire cutting machine is currently used to cut crystalline silicon. Using it to cut crystalline silicon has the advantages of fast speed, low cost and environmental protection. Advantages, while the main working part of the diamond wire cutting machine is a cutting wire with diamond particles consolidated on its surface by electroplating, which is the diamond wire. When cutting crystalline silicon, the quality of the diamond wire directly affects the quality and production efficiency of the cut silicon wafers. The quality of the diamond wire needs to be strictly monitored duri...

AI Technical Summary

Problems solved by technology

When cutting crystalline silicon, the quality of the diamond wire directly affects the quality and production efficiency of the cut silicon wafers. The quality of the diamond wire needs to be strictly monitored during the production process, and the most important parameter that determines the quality of the diamond wire is the consolidation in the The number of diamond particles of different particle sizes on the surface, the traditional diamond wire quality inspection method is to use the offline detection method, put the produced product under a high-power microscopic camera to take pictures, and then obtain the diamond wire through manual or computer-aided analysis. The quality parameters of this method; the detection speed of this method is slow, and the detection process is not easy to control

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