On-line quality inspection method of diamond wire particles based on machine vision

Abstract

The invention discloses an online quality inspection method for diamond wire particles based on machine vision. A single-axis mechanical arm is arranged along the moving direction of the diamond wire, a camera and a microscope lens are arranged on the single-axis mechanical arm, and the movement of the mechanical arm and the diamond wire in the same direction reduces the number of cameras. The relative speed difference with the diamond wire improves the clarity of the image. Use the workstation to perform RIO cropping on the original image of the diamond wire, and delete the image area that does not contain the diamond wire information; filter the RIO cropped image to remove the noise of the image; Perform binary segmentation on the filtered image; use morphological closure operation to optimize the image after binary segmentation; use the connected region marking method based on run-length code table search to count the diamond wire particles in the optimized image, and get the diamond wire The statistical data of the particles, the image acquisition and processing can be completed when the diamond wire is moving, and the online quality inspection is realized. The detection speed is fast, and the entire quality inspection process is automatically completed.

Description

technical field [0001] The invention relates to the field of detection of cutting wires, in particular to an online quality inspection method of diamond wire particles based on machine vision. Background technique [0002] Crystalline silicon is an important raw material for solar photovoltaic industry and semiconductor industry. Since crystalline silicon is a typical hard and brittle material, diamond wire cutting machine is currently used to cut crystalline silicon. Using it to cut crystalline silicon has the advantages of fast speed, low cost and environmental protection. Advantages, while the main working part of the diamond wire cutting machine is a cutting wire with diamond particles consolidated on its surface by electroplating, which is the diamond wire. When cutting crystalline silicon, the quality of the diamond wire directly affects the quality and production efficiency of the cut silicon wafers. The quality of the diamond wire needs to be strictly monitored durin...

AI Technical Summary

Problems solved by technology

When cutting crystalline silicon, the quality of the diamond wire directly affects the quality and production efficiency of the cut silicon wafers. The quality of the diamond wire needs to be strictly monitored during the production process, and the most important parameter that determines the quality of the diamond wire is the consolidation in the The number of diamond particles of different particle sizes on the surface, the traditional diamond wire quality inspection method is to use the offline detection method, put the produced product under a high-power microscopic camera to take pictures, and then obtain the diamond wire through manual or computer-aided analysis. The quality parameters of this method; the detection speed of this method is slow, and the detection process is not easy to control

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