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return envelope

A technology of envelopes and bodies, applied in the field of round-trip envelopes, can solve the problems such as the difficulty of making envelopes, and achieve the effect of easy judgment

Inactive Publication Date: 2016-03-16
宋有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The above-mentioned Patent Document 1 has the following problems: because the round-trip envelope must require 2 sealing sheets (3, 4), it is not easy to make an envelope

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0060] First refer to figure 1 , 2 , illustrating the overall structure of the round-trip envelope according to the embodiment of the present invention.

[0061] The return envelope includes an envelope body 100 and a sealing sheet 200 . The shuttle envelope shown in this embodiment has an envelope in an elongated shape.

[0062] The above-mentioned envelope body 100 has figure 1 shown on the front side of 110 and figure 2 120 shown on the back. Similarly, the sealing sheet 200 also has figure 1 shown on the front of 210 and figure 2 The rear side 220 is shown.

[0063] The envelope body 100 is provided with an opening 101 for inserting mail contents.

[0064] The sealing piece 200 is provided in a form extending further from the opening 101 on the front surface 110 of the envelope body 100 .

[0065] The front 110 of the envelope body 100 is provided with a postage stamp area 111a for outgoing letters. This postage stamp attachment area 111 a is provided on the up...

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PUM

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Abstract

A round trip envelope with front and back faces for writing the outgoing and return addresses, and which enables sealing for both of outgoing mail and return mail sealing flap, which can prevent erroneous postmarking of a stamp. An outgoing stamp affixing area and address writing area are on the front face of the envelope body, and a return stamp affixing area and a return address writing area on the back face. An adhesive area for sealing a sealing flap in a blank area on the back face, in a vicinity of an opening. A distal end portion of the sealing flap extending beyond the adhesive area constitutes a return-mail sealing flap.

Description

technical field [0001] The invention relates to a round-trip envelope capable of sending and replying letters. Background technique [0002] In the prior art, round-trip postcards are usually used, but round-trip envelopes are generally not used. [0003] Japanese Unexamined Patent Publication No. 10-119975 (Patent Document 1) discloses a round-trip envelope in which two seals (4) for outgoing letters and (3) for return letters are provided. [0004] Disclosed in No. 2003 / 055759 (Patent Document 2) is a round-trip envelope, wherein the seal of the tongue (5) is disassembled when unsealing, and the address used to write the letter on the tongue (5) at the same time , and write the address used for the return letter at the position hidden by the tongue (5), and use the same side of the envelope to show the address for the outgoing letter and the address for the return letter. [0005] Japanese Patent Laid-Open No. 2010-132313 (Patent Document 3) also discloses a round-trip e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D27/06
CPCB65D27/06
Inventor 宋君哲
Owner 宋有限责任公司