A backing plate for PCB drilling and manufacturing method thereof

A manufacturing method and backing plate technology, which is applied in the field of PCB processing and manufacturing, can solve the problem that the backing plate for drilling cannot be applied to high-grade PCB boards, and achieve the effects of small deformation rate, reduced brittleness, and reduced frictional heat generation

Active Publication Date: 2016-03-23
烟台柳鑫新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a backing plate for drilling holes in PCB and its manufacturing method, aiming to solve the problem that the backing plate for drilling holes in the prior art cannot be applied to the production of high-grade PCB boards

Method used

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  • A backing plate for PCB drilling and manufacturing method thereof

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] The invention provides a backing plate for PCB drilling, such as figure 1 As shown, the backing plate includes: a honeycomb core material layer 2, and a hardness panel layer 1 arranged on the upper surface and the lower surface of the honeycomb core material layer.

[0022] The hardness panel layer 1 is formed by hot-pressing single-layer or multi-layer special paper after being superimposed and immersed in resin glue; the special paper is balance paper, wood pulp paper, kraft paper or non-plant fiber material.

[0023] Non-plant fiber materials include non-woven fabrics, glass f...

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Abstract

The invention provides a backing plate for PCB drilling and a manufacturing method of the backing plate. The backing plate comprises a honeycomb type core material layer and hard panel layers which are respectively arranged on the upper surface and the lower surface of the honeycomb type core material layer, wherein as the honeycomb type core material is arranged in the middle of the backing plate, the generation of heat by friction of a drill point can be reduced, the drill bit temperature can be lowered, the abrasion of the drill bit can be reduced, the service life of the drill point can be prolonged; furthermore, drilling cuttings which are adhered on a drill point chip space are thrown away from the drill bit with high-speed rotation of the drill bit, and then the drilling cuttings are retained in the honeycomb structure of the backing plate; the honeycomb structure can allow the backing plate to be lighter than the laminated backing plate in common use and to be stored, cut and used more easily; in addition, the particular honeycomb enables the cohesion of the panel and the deformation rate to be lower, and reduces the brittleness, so as to provide convenience for PCB drilling technological operation.

Description

technical field [0001] The invention relates to the technical field of PCB processing and manufacturing, in particular to a backing plate for PCB drilling and a manufacturing method thereof. Background technique [0002] The backing plate is often used in the drilling process in the PCB manufacturing process. The main indicators are thickness and its tolerance, hardness, warpage, etc. The thickness of the backing plate is generally controlled at 1-4mm. If it is too thin, the drilling depth generally reaches If the design requirements are not met, chip removal is poor. If the designed drilling depth needs to be reached, the backing plate can only be used on one side, resulting in material waste; Production efficiency is low. The thickness tolerance is controlled at <±0.5mm, which is to closely fit the backing plate and the PCB board during drilling, to prevent the phenomenon that the gap between the gaps will increase the outlet edge or the drill bit will be broken due to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B3/12B32B29/06B32B27/04B32B27/02B32B27/34B32B29/02B32B7/12B32B37/12B32B37/10
Inventor 欧亚周杨柳张伦强刘飞
Owner 烟台柳鑫新材料科技有限公司
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