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Pick-up device structure in the device isolation region

A device isolation and intra-area technology, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as inefficiency

Active Publication Date: 2017-05-10
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technique is less effective when isolated heavily doped regions are used for circuitry adjacent to photosensitive devices

Method used

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  • Pick-up device structure in the device isolation region
  • Pick-up device structure in the device isolation region
  • Pick-up device structure in the device isolation region

Examples

Experimental program
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Embodiment Construction

[0034] It should be appreciated that the following disclosure provides many different embodiments or examples for implementing different features of the invention. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to limit the invention. In addition, in the following description, performing the first process before the second process may include an embodiment in which the second process is directly performed after the first process, and may also include an embodiment in which an additional process may be performed between the first process and the second process. Example of process. Various features may be arbitrarily drawn in different scales for simplicity and clarity. In addition, forming the first part on or over the second part may include an embodiment in which the first part and the second part are formed in direct contact, and may also include that additiona...

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Abstract

A device includes a device isolation region formed into a semiconductor substrate, the device isolation region having gaps for photo-sensitive devices, a dummy gate structure formed over the substrate, the dummy gate structure comprising at least one structure that partially surrounds a doped pickup region formed into the device isolation region, and a via connected to the doped pickup region.

Description

technical field [0001] The present invention relates to pick-up device structures in device isolation regions. Background technique [0002] Photosensitive devices are used in various electronic devices. For example, arrays of photosensitive devices can be used to form image sensor arrays to be used in digital cameras. Photosensitive devices typically include an active region within a semiconductor material that converts light energy into electrical energy. [0003] Each cell within the photosensitive device array includes a main photosensitive area and some circuit components, such as transistors and resistors for measuring the current produced by the photosensitive device. It is important to isolate these circuit components from the photosensitive area since stray currents can cause dark currents in the photosensitive area. This adversely affects the light intensity measurement carried out by the photosensitive area. [0004] One approach to isolating device structures...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/1463H01L27/1443H01L27/14636H01L27/14643H01L27/14683H01L27/14687H01L31/102H01L31/18
Inventor 高敏峰杨敦年刘人诚许慈轩陈思莹徐伟诚曾晓晖
Owner TAIWAN SEMICON MFG CO LTD