Server cooling system combining air-cooled natural cooling heat pipe air conditioner and liquid cooling device

Abstract

The invention discloses a server radiating system combining an air-cooled naturally-cooled heat pipe air-conditioner with a liquid-cooled device. The server radiating system comprises a liquid-cooled server cabinet, the liquid-cooled server cabinet comprises a cabinet body and a plurality of liquid-cooled servers arranged in the cabinet body, the liquid-cooled device is arranged to be used for direct liquid-cooling radiating of the liquid-cooled servers, and the air-cooled naturally-cooled heat pipe air-conditioner is arranged to be used for auxiliary radiating. The server radiating system has the advantages of high-density cooling, high heat exchange efficiency, low energy consumption, capability of overcoming local hot spots, small occupied area, high reliability, low noise and long service life. A standard server cabinet can be applied to the server radiating system.

Description

technical field [0001] The invention relates to a heat dissipation system for a server cabinet, in particular to a server heat dissipation system combined with an air-cooled natural cooling heat pipe air conditioner and a liquid cooling device. Background technique [0002] With the continuous increase of high-density cabinets in the IDC Internet data center computer room, the integration of equipment is getting higher and higher, and the processing capacity is gradually increasing, but the power consumption of the equipment is also increasing, resulting in more heat generated by the equipment in the cabinet. According to statistics, at present, the cabinet servers in large-scale IDC computer rooms in China generate a lot of heat, and basically run 8760h throughout the year. It accounts for about 40%~50% of the overall energy consumption of the data center. [0003] Traditional data room air supply methods include floor air duct air supply, hot and cold aisle isolation air ...

AI Technical Summary

Problems solved by technology

The heat pipe radiator of this patent is only attached to the server, and does not perform the most direct heat dissipation on the main heat-generating device. In addition, the system performs two-loop heat exchange through the intermediate heat exchanger, which is also It is bound to lead to lower heat transfer efficiency than direct heat transfer

In addition, this patent only considers the heat dissipation scheme of the main heating element (CPU) of the server, but does not consider the heat dissipation of other heating elements (memory hard disk, etc.), so the heat dissipation scheme proposed in this patent is not perfect enough.

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