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Porous cover structures for mobile device audio

A technology of audio and casing, applied in the field of acoustic integration and/or mechanical integration, which can solve the problems of inconvenient placement

Inactive Publication Date: 2015-06-24
NOKIA TECHNOLOGLES OY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This trend conflicts with audio requirements that often require large and / or inconveniently placed sound inlets and outlets that interfere with the aesthetics of the mobile device

Method used

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  • Porous cover structures for mobile device audio
  • Porous cover structures for mobile device audio
  • Porous cover structures for mobile device audio

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Embodiment Construction

[0019] Some embodiments of the inventions will now be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the inventions are shown. Indeed, various embodiments of the invention may be embodied in many different forms and should not be construed as limited to those set forth herein; rather, these embodiments are provided so that this disclosure will satisfy Applicable Legal Requirements. Like reference numerals refer to like elements throughout.

[0020] Mobile devices typically include audio components (eg, speakers, microphones) that are integrated into the mobile device. Integration of such audio components requires consideration of the mechanical and acoustic properties of the components, which may sometimes conflict with the desired industrial design (eg, desired appearance) of the mobile device. In a typical device, the sound outlet and / or inlet in the mobile device housing generally includes one or mor...

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Abstract

A method is provided according to an example embodiment of the present invention for providing a porous cover structure for a mobile device for use with integrated audio components. Sound inlets and / or outlets in a mobile device cover may be replaced by one or more areas of microholes which are small enough to be invisible or almost invisible to the naked eye. The porous region may be located and dimensioned in a way that provides the best compromise between industrial design, mechanics, and audio requirements. Further, the audio component mechanics beneath the cover may be modified to take additional advantage of the porous cover structure, and the porous structure may also be used as an improved dust and liquid protection feature. A corresponding housing component and apparatus are also provided.

Description

technical field [0001] Example embodiments of the present invention generally relate to acoustic and / or mechanical integration of audio components in mobile devices. Background technique [0002] Mobile devices typically include audio components (eg, speakers, microphones) integrated into the device. The integration of such audio components requires consideration of the mechanical and acoustic properties of the components, which may sometimes conflict with the desired industrial design for mobile devices. One of the most visible considerations concerns the sound outlet and / or inlet of the mobile device. Such a sound outlet design is important because the sound outlet has to be designed in such a way that, taking into account all acoustic requirements, it should still have a suitable visual effect so that the overall appearance of the mobile device is not negatively affected. A traditional approach would be to create a small number of fairly large holes (eg, about 1 mm in d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/08H05K5/02
CPCH04R1/02H04R1/023
Inventor T·B·斯洛特M·奥克斯曼
Owner NOKIA TECHNOLOGLES OY
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