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Light-emitting diode packaging structure and packaging method thereof

A technology of light-emitting diodes and packaging methods, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve problems such as difficulty in ensuring accuracy and affect the accuracy of packaging components, and achieve the effect of high packaging accuracy

Active Publication Date: 2018-09-07
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In this manufacturing method, the step of "inserting light-emitting diode grains into the reflective cup structure" needs to align the light-emitting diode grains with the conductive copper plate. Due to the limitation of the accuracy of the alignment mechanical equipment, small-sized light-emitting diodes It is difficult to ensure the accuracy of the packaging position of the die in the reflective cup structure, which affects the accuracy of the entire packaging component

Method used

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  • Light-emitting diode packaging structure and packaging method thereof
  • Light-emitting diode packaging structure and packaging method thereof
  • Light-emitting diode packaging structure and packaging method thereof

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Embodiment Construction

[0022] see figure 1 , figure 2 and image 3 , the light emitting diode package structure 10 provided by the embodiment of the present invention includes a package body 11 , a light emitting diode die 12 , an insulating layer 13 and two pins 14 .

[0023] The package body 11 is made of a light-transmitting material, such as epoxy resin, etc., preferably, the package body 11 is mixed with phosphor powder to emit light at the same wavelength as the light-emitting diode chip 12 under the light excitation of the light-emitting diode chip 12. Different light, thus mixing light to get the desired color of light.

[0024] The LED chip 12 is embedded in the bottom of the package body 11 , and the two electrodes 120 , 122 of the LED chip 12 are exposed from the bottom of the package body 11 .

[0025] The insulating layer 13 is opaque and covers the bottom of the package body 11 , and the insulating layer 13 is hollowed out at the corresponding electrodes 120 , 122 to form two reces...

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Abstract

A light-emitting diode packaging structure, including a package body, a light-emitting diode grain, an opaque insulating layer, and two pins, the light-emitting diode grain is embedded in the bottom of the package body, and the two electrodes of the light-emitting diode grain Exposed from the bottom of the package body; the insulating layer covers the bottom of the package body, and the insulating layer is hollowed out at the two electrodes corresponding to the light-emitting diode crystal grains to form two recesses exposing the two electrodes of each light-emitting diode crystal grain; The two pins are respectively arranged in one of the two recesses, and each lead extends from the recess of the insulating layer in a direction away from the package body and partially covers the surface of the insulating layer away from the package body. The invention also provides a packaging method of the LED packaging structure.

Description

technical field [0001] The invention relates to a semiconductor light emitting device and a packaging method thereof, in particular to a light emitting diode packaging structure and a packaging method thereof. Background technique [0002] Compared with traditional light sources, light emitting diodes (Light Emitting Diode, LED) have the advantages of light weight, small size, low pollution, long life, etc. As a new type of light source, it has been increasingly used in In various fields, such as street lights, traffic lights, signal lights, spotlights and decorative lights. [0003] The existing LED packaging structure usually includes a lead frame with a metal conductive line and a reflective cup structure, a light-emitting diode chip arranged in the reflective cup structure of the lead frame and electrically connected to the metal conductive line, and filled in the reflective cup structure And cover the packaging body of the light emitting diode chip. When making this k...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/62H01L33/48
CPCH01L33/48H01L33/62H01L2933/0033H01L2933/0066H01L24/96H01L24/97H01L33/0095H01L33/52H01L2224/04105H01L2224/73104H01L2924/12041H01L2924/181H01L2933/005H01L2924/00
Inventor 张超雄陈滨全林厚德陈隆欣曾文良
Owner ZHANJING TECH SHENZHEN