Temperature insulation apparatus for electronic component housing

A technology of electronic components and heat preservation devices, which is applied in the fields of cabinet/cabinet/drawer components, cooling/ventilation/heating transformation, etc., and can solve problems such as low temperature and abnormal operation of electronic components

Inactive Publication Date: 2015-10-28
SUZHOU GUTESI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Electronic component packaging is used to store electronic components. The current electronic component packaging is mostly a closed shell structure. Because the closed structure has a certain heat preservation performance, when used in cold regions, electronic components still exist. The temperature is too low to work abnormally, so it is necessary to study an electronic component package that can be used without hindrance in the alpine region

Method used

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  • Temperature insulation apparatus for electronic component housing

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Embodiment Construction

[0015] The thermal insulation device of the electronic component shell of the present invention comprises a housing 1 and an electronic component body 2 arranged in the housing 1, the inner wall of the upper housing 1 of the housing 1 is bonded with a plush layer 3, and the plush layer 3 is bonded to the inner wall of the shell 1. An auxiliary heating device is arranged between the inner walls of the housing 1 . The above-mentioned auxiliary heating device is a heat-conducting wire mesh 41 laid on the inner wall of the casing 1 in a grid shape, and a heating element 42 connected with the heat-conducting wire mesh 41 . By adopting the above-mentioned structure, the plush layer 3 and the auxiliary heating device are used to ensure the temperature inside the housing 1, so that the end product can be used in extremely cold regions and will not fail to work due to overcooling.

[0016] In order to conduct the temperature generated by the electronic components in time, a heat-conduc...

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Abstract

The invention discloses a temperature insulation apparatus for an electronic component housing. The temperature insulation apparatus comprises a housing and an electronic component body mounted in the housing. The apparatus is characterized in that the inner wall at an upper housing of the housing is adhesively provided with a lint layer. Between the lint layer and the inner wall of the housing is an auxiliary heating device. With such a structure and by utilizing a lint layer and an auxiliary heating device, the temperature inside the housing can be guaranteed so that a product with such an apparatus can still manage to work even in extremely cold regions.

Description

technical field [0001] The invention relates to a thermal insulation device for an electronic component shell, in particular to a thermal insulation device for an electronic component shell with a compact structure and good thermal insulation effect. Background technique [0002] Electronic component packaging is used to store electronic components. The current electronic component packaging is mostly a closed shell structure. Because the closed structure has a certain heat preservation performance, when used in cold regions, electronic components still exist. The temperature is too low to work abnormally, so it is necessary to study an electronic component package that can be used without hindrance in the alpine region. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a thermal insulation device for the housing of electronic components, which has the characteristics of compact structure and good thermal insulatio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02H05K7/20
Inventor 金建华
Owner SUZHOU GUTESI ELECTRONICS TECH
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