Displacement vector filling method based on approximate spherical filling of energetic materials

A filling method, displacement vector technology, applied in the field of materials science, can solve problems such as lack

Active Publication Date: 2018-06-29
CHONGQING UNIV OF POSTS & TELECOMM
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0007] Through the analysis of the existing domestic data, it is found that there is still a lack of methods to control the random placement process, intervene in the distance of particle generation, and make the compression chamber "shake" after placement, so as to try to place it again

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  • Displacement vector filling method based on approximate spherical filling of energetic materials
  • Displacement vector filling method based on approximate spherical filling of energetic materials
  • Displacement vector filling method based on approximate spherical filling of energetic materials

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Embodiment Construction

[0032] Below in conjunction with accompanying drawing, the present invention will be further described:

[0033] see figure 1 , image 3 For the analysis process of the present invention, as shown in the figure, the present invention provides an algorithm based on the approximate spherical filling maximization of energetic materials. The algorithm includes a filling stage and an adjustment stage. The steps are as follows:

[0034] Filling phase:

[0035] 1. Spherical particles are randomly put into the compression chamber according to the radius from large to small, and the radius is r 1 ,r 2 ,r 3 ......r n , set the maximum number of attempts to be 1 million times, the maximum gap to be d, and p to represent spherical particles;

[0036]2. Every time a spherical particle (except the first one) is placed, it will be compared with all previous particles one by one. If it intersects with any particle, this placement will be abandoned. If the distance to any particle is gre...

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Abstract

The present invention claims to protect a displacement vector filling method based on the approximate spherical filling of energetic materials, which includes the steps of randomly placing spherical particles into the compression chamber according to the radius from large to small, and after completing the spherical particle placement stage , enter the adjustment stage; the adjustment stage is divided into three processes, that is, the spherical particles move to the negative direction of the x-axis according to the x-axis coordinates from small to large, and then move to the negative direction of the y-axis according to the y-axis coordinates from small to large, and finally press The z-axis coordinates move from small to large in the negative direction of the z-axis; in the present invention, after the above-mentioned particle movement, the inter-particle gaps are minimized, and the cabin can continue to be filled to increase the filling rate.

Description

technical field [0001] The invention belongs to the fields of material science and computer science, and in particular relates to a method for solving the problem of low filling rate of compression chambers caused by dispersion of spherical particles of different sizes and random positions when filling in the field of energetic material compression, and excessive gaps , Background technique [0002] Energetic materials are energetic compounds, referred to as energy materials, meaning high energy density substances (HEDM); it is characterized by the fact that such substances are mostly explosive, deflagration, or other substances that release a large amount of energy at a high rate and high output after specific excitation conditions substance. The mechanical properties of energetic materials mainly refer to the mechanical characteristics exhibited when they are subjected to various external loads (tension, compression, bending, torsion, impact, alternating stress, etc.) und...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
Inventor 豆育升陈人华黄晓雪唐红周俊辉
Owner CHONGQING UNIV OF POSTS & TELECOMM
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