Grinding device

A technology for grinding and processing objects, used in grinding/polishing equipment, parts of grinding machine tools, metal processing equipment, etc.
CN105290969BActive Publication Date: 2019-03-15DISCO CORP
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
DISCO CORP
Publication Date
2019-03-15

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Abstract

The present invention provides a grinding device which is able to make a measurement probe steadily touch the upper surface of a processed object and measure the thickness of the processed object in the condition of grinding a plurality of measured objects at the same time. The grinding device comprises a maintenance unit with a maintenance configured to maintain the processed object (W); a grinding unit configured to grind the back (WR), used for maintenance, of the processed object (W); and a height finder (40) configured to measure the height of the back (WR) of the processed object (W) grinded by the grinding unit. The height finder (40) has two measurement probes (43) arranged at the positions having the same height at the contact points on the back (WR) of the processed object (W). The two measurement probes (43) are arranged on the circle (C) taking a rotation axis (A) as a center along the maintenance unit, and are separately arranged in an interval (W1) of larger than an adjacent processed object (W) at the circumference.
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Description

technical field

[0001] The present invention relates to a grinding device for grinding a workpiece while measuring the height of the upper surface of the workpiece. Background technique

[0002] When grinding various workpieces thinly and finishing them to a desired thickness, the grinding is performed while measuring the thickness of the workpieces, and the grinding is terminated when the thickness reaches the desired thickness. As a method of measuring the thickness of a workpiece, there is known a contact measurement method in which a contact piece of a thickness measuring device is brought into contact with the surface holding the workpiece and the surface of the table holding the workpiece, and the difference in height between them is obtained. , and calculate the thickness of the workpiece from the difference (for example, refer to Patent Document 1).

[0003] On the other hand, as wafers as workpieces formed of sapphire, gallium nitride (GaN), etc., some wafers have ...

Claims

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