A Back Thinning Method of Refrigerated Infrared Focal Plane Detector

An infrared focal plane and detector technology, applied in the field of detectors, can solve problems such as low process efficiency, and achieve the effects of simple processing method, low process efficiency and controllable processing technology.

Active Publication Date: 2018-02-16
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] In view of the above-mentioned analysis, the present invention aims to provide a method for thinning the back of a cooled infrared focal plane detector to solve the problem of low process efficiency in the prior art for thinning the back of a cooled infrared focal plane detector

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  • A Back Thinning Method of Refrigerated Infrared Focal Plane Detector
  • A Back Thinning Method of Refrigerated Infrared Focal Plane Detector

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Embodiment Construction

[0020] Preferred embodiments of the present invention will be specifically described below in conjunction with the accompanying drawings, wherein the accompanying drawings constitute a part of the application and are used together with the embodiments of the present invention to explain the principle of the present invention. For the sake of clarity and simplicity, detailed descriptions of known functions and constructions in the devices described herein will be omitted when it may obscure the subject matter of the present invention.

[0021] In order to solve the problem of low process efficiency of thinning the back of the cooled infrared focal plane detector in the prior art, the present invention provides a method for thinning the back of the cooled infrared focal plane detector. The following is combined with the accompanying drawings and several implementations For example, the present invention will be described in further detail. It should be understood that the specif...

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Abstract

The invention discloses a refrigerating type infrared focal plane detector back face thinning method. The method comprises the steps that a refrigerating type infrared focal plane detector is roughly machined into the first preset thickness through a diamond cutting machine; and furthermore, the refrigerating type infrared focal plane detector roughly machined to the first preset thickness through the diamond cutting machine is finely machined to the second preset thickness. Back face thinning is carried out on the refrigerating type infrared focal plane detector through diamond cutting, and due to the fact that a smooth diamond point can enable the machined surface to have the minimum residual stress and the ideal roughness and meanwhile clamps are not involved, when devices of different sizes are cut, pressure and other technology parameters do not need to be designed again. Thus, the machining method is simple, the machining technology is controllable, and therefore the problem that in the prior art, the technology for back face thinning of the refrigerating type infrared focal plane detector is low in efficiency is effectively solved.

Description

technical field [0001] The invention relates to the technical field of detectors, in particular to a method for thinning the back of a cooled infrared focal plane detector. Background technique [0002] The cooled infrared focal plane device uses backlighting to collect light energy. Only by thinning the chip from the back to make it absorb photons near the surface can the generated photocarriers diffuse to the PN junction area. Therefore, the thickness of the thinned material must be less than the minority carrier diffusion length. [0003] At present, the back thinning of cooled infrared focal plane detector devices is mainly realized by grinding and polishing process. The polishing pad bonded on the polishing disc is used as the base, the base is in close contact with the back of the device, and a certain pressure is applied to the device through a fixing fixture. During polishing, the polishing disc and the fixture rotate relatively, and at the same time, a special pol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04B24B37/10H01L21/02
CPCB24B37/042B24B37/10H01L21/02016Y02P70/50
Inventor 肖钰赵建忠
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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